Go to main content
Die bonding
Search
Kontaktieren sie uns
Menu
Die bonding
Close
Search
About us
History
About us
Under the MRSI brand, we offer industry-leading die bonders, with superior flexibility, ultra-high-accuracy, and multiple process options. Our product’s' value is further illustrated by our 35+ years of experience in the industry in tandem with our 24/7 reliable field operations.
About us
History
Products
High precision dispensing solutions
Active alignment solutions
Products
MRSI values our customers, and our top priority is meeting our customers needs down to the finest detail. We are proud that all of our products are industry-leading, with superior flexibility, ultra-high-accuracy, and multiple process options.
Products
High precision dispensing solutions
Active alignment solutions
Service & support
Case
Career
News & events
Press releases
News
Events
Photonics West 2024
Chiplet Summit 2024
OFC 2024
SEMICON West 2024
IMAPS New England 2024
Compound Semiconductor Conference
Webinars
News & events
News & events
Press releases
News
Events
Photonics West 2024
Chiplet Summit 2024
OFC 2024
SEMICON West 2024
IMAPS New England 2024
Compound Semiconductor Conference
Webinars
Contact us
MRSI North America
MRSI Automation (Shenzhen) Co., Ltd.
Mycronic Sweden HQ
Contact us
Visit our contact page for contact details for our sales and support departments.
Contact us
MRSI North America
MRSI Automation (Shenzhen) Co., Ltd.
Mycronic Sweden HQ
Anmelden
Startseite
News & events
Events
4. September
Shenzhen, China
China
English
IFOC
Location: Shenzhen, China. Dr. Limin Zhou to present “Automotive Lidar Package & Assembly Technology Evolution Trend“
Learn more
28.04.2024 12:21:20