Change has come to solder paste printing.

Change has come to solder paste printing.

Change has come to solder paste printing.

Experience the freedom and precision of jet printing

Screen printing has long been the go-to solution for long series production. But as batch sizes shrink and component complexity grows, traditional screen printing has reached its limits.

The MY700 Jet Printer helps you meet tomorrow’s challenges by ensuring perfect software-controlled solder paste deposits at speeds of more than one million dots per hour.

Quality starts with perfect solder deposits

More than sixty percent of PCB defects originate in the solder paste process, according to market surveys. This is a problem stencils alone won’t solve.

The MY700 can replace stencil printing with a fully software-controlled solution that allows you to instantly respond to customer demands and changes with superior accuracy for every solder joint. As an add-on technology, it relieves your volume production line for on-the-fly revisions, small-batch jobs or difficult applications.

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Take total control of every deposit

The MY700 gives you full volume and diameter control of every deposit at extremely high speeds.

Simply prepare a new job from any CAD or Gerber data in minutes. Make changes and adjustments on-the-fly. And use a combination of fine-pitch and large-dot ejectors to print boards for extremely small and large components.

Combined with the PI Series 3D SPI, you can even create a fully closed-loop solder paste repair system to ensure the highest possible first pass yield for every job.

Producers of electronics looking for flexible all-material dispensing, can use the MY700 with the APJ1000S jet valve, resulting in the fastest all-material jetting system on the market.

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