More process data. Faster innovation cycles. Smarter factory systems. As the pace of change accelerates, we’re convinced that tomorrow’s PCB assembly environment should be a simpler place. A place where no build schedule is too complex. No defect goes unprevented. And no production is left standing still. From naked board to coated product – and everything in between.
At Productronica 2021, you’ll have the chance to bring us your bottlenecks, quality issues and integration challenges. Join us in hall A3, booth 342, on November 16-19 and put our process experts to the test.
Together, we can build the future of electronics assembly.
Agile solutions for a changing industry
As electronics assembly continues to grow more complex trending towards smaller batch sizes and less predictable production environments, Mycronic will exhibit an array of new opportunities to enhance manufacturing agility. Regardless of their production volume, Productronica visitors will have the opportunity to discuss their most pressing production bottlenecks with Mycronic’s experts, whether the challenge is optimized planning, anticipating and adapting to process variations, or enabling product customization down to batch-size-one.
High-reliability manufacturers looking to secure their output quality for mission-critical applications in industries such as aerospace, medical or automotive, will be presented a full range of process control, traceability and dispensing solutions.
It’s part of a continuous strategy
Enhanced connectivity and process control
For EMSs eager to convert production data into higher productivity, a number of new data visualization and programming tools will also be demonstrated in the Mycronic booth. This will be illustrated by MYCenter Analysis, a powerful process control software to monitor and enhance overall equipment effectiveness based on real time production data.
"Our process solutions already cover all of the factory workflows surrounding PCB assembly," says Clemens Jargon, Sr VP, Assembly Solutions High Flex, "including every process from naked board to coated product. Now we’re bringing all this production and inventory data to the surface, making it more visible and more actionable. It’s part of a continuous strategy to minimize the effort that goes into data preparation and programming, while enhancing user control."
Closing loops in line automation
With the fully Hermes compliant MYPro Line, Mycronic’s integrated SMT line solution, visitors will experience a growing range of new automation features, closed-loop processes and process control capabilities.
The MYPro Link software, which correlates data between solder paste inspection and automated optical inspection, now features even more interconnected process controls to further improve inspection efficiency and line performance. Another example of smart process integration will be given by the award-winning Jet printer and SPI system which precision combined with the repair loop feature result in a near zero-defect solder paste printing process.
Double up on smarter storage
The market’s most efficient near-production robotic storage system got more versatile. MYTower series X will be presented at Productronica and will show how an innovative inventory system can double the capacity.
MYTower series X gives manufacturers the most space-efficient intelligent storage system available. EMS producers can consolidate and automate inventory within smaller space or reduce the amount of storage systems, freeing up floorspace for optimal workflows.
Beyond PCB assembly with coating and dispensing
Thanks to new equipment and models, the MYSmart range has turned into a complete one-stop shop for all coating and dispensing needs. For the first time, visitors will be presented a complete coating line, including a modular UV curing oven and coating inspection unit, among other innovations.
On the dispensing side, the new MYC60 industrial dispenser for heavy-duty PCBs will be presented, while EMSs looking for speed should not miss the fastest all-material jet dispenser on the market today using the MY700 with the new APJ1000S jet valve.
High-speed die bonding solutions
MRSI Systems, part of Mycronic Group, is the leading manufacturer of fully automated, high-speed, high-precision and flexible eutectic and epoxy die bonding systems.
MRSI offers a complete suite of products across the volume spectrum which satisfies your requirements.
MRSI will be demonstrating the MRSI-H-HPLD 1.5 micron die bonder at Productronica. The product is designed for bonding large high-power laser diodes in mass production. The system focuses on solving an application need while delivering industry-leading speed within each volume category without sacrificing flexibility, precision or reliability.
To experience live demos and to learn more about Mycronic’s MYPro Line, software and connectivity solutions, dispensing and coating platforms, and other assembly solutions, visit hall A3, booth 342 at Productronica in Munich, November 16-19, 2021.
The Bavarian State Government granted official approval for Bavarian trade fairs from August 1, 2021. A safety concept has been developed by Messe Munich in close cooperation with government officials, comprising specifications and regulations with regard to health and safety. Read on Messe Munich’s site
Text: Karolina Lundkvist
Published: 8 October 2021