Unlocking the Future of Data with Photonic Solutions
In today’s hyper-connected world, the limitations of traditional electronic data transfer are becoming increasingly apparent. That’s why photonic solutions – leveraging light instead of electrons – are emerging as the preferred method for overcoming the bandwidth bottlenecks and packaging challenges.
Leading the Photonic Revolution
Vanguard Automation provides cutting-edge photonic integration and packaging solutions for Telecom and Datacom customers. Our comprehensive solutions portfolio for optical connectivity and integration includes:
- Photonic Wire Bonding: Enabling flexible, reliable connections between optical components.
- Facet-Attached Micro-Lenses: Optimizing light coupling efficiency for enhanced performance.
The solution portfolio is facilitated with a complete manufacturing and material system that is supplied by Vanguard Automation.
The solution is industry proven and Telcordia GR-468-CORE qualified.
- High Performance
- High Yield
- High Reliability
Solving the Challenges of Hybrid Photonic Integration
We specialize in addressing the unique challenges associated with integrating and packaging hybrid photonic devices, including:
- Photonic Integrated Circuits (PICs)
- Optical Components
- Fiber arrays
- Active devices
The manufacturing processes enable the fabrication of optical connections directly onto optical components.
- Material Compatibility: Our processes are compatible with all commonly used materials for PICs and optical components.
- Wavelength Range: Our solutions support a wide operational range from 530 nm to 2000 nm.
Partner with Vanguard Automation to unlock the full potential of your photonic technologies and revolutionize data transfer capabilities.
Relevant Applications:
- Silicon Photonics
- Transceivers
- PICs
- Co-Packaged Optics
- Optical Switches