Paperless productivity

– changeover guidance with Agilis Smart Bin

 
Missing components. Sticky notes falling off. Hunting for information. The list of reasons for unplanned downtime could go on. But in most cases, line utilization is heavily dependent on efficient material and information handling.

Lower changeover cost with Agilis Smart Bin system

The most common reason for unplanned downtime in high-mix electronics manufacturing is missing material. The Agilis Smart Bin system will help machine operators minimize downtime by ensuring that all needed material is collected and prepared just-in-time for production. 

Building on our already powerful material handling solutions, including the SMD Tower automated storage, the Agilis Smart Bin system brings unparalleled ease-of-use to the kitting and changeover process. The end result is faster changeovers and higher utilization – improving your bottom line.

Key benefits

• Paperless kitting guidance and changeover instructions – right in front of you
• Preload in Agilis Bins for upcoming jobs – without losing track of material location
• Easily locate missing components wherever they are
• Faster changeovers and higher utilization
     

Empty bin. Free to load for next job	Pre-loading bin F-375 according to MYCenter guidance.	Kitting complete. Insert magazine in machine MY100B, slot 7.	Machine running. Keep magazine in machine MY100B, slot 7.	Changeover. Bring reels in positions 4, 9 and 12 to Workstation 2.

Complete kitting and changeover guidance

The intuitive instructions are presented where the actual work takes place, directly on the material container, minimizing unnecessary movements across the factory floor in search for information.

The upper-left side of the e-label shows an icon for easy indication of the bin’s material status: kitting ongoing, ready to bring to machine, ready for changeover, etc. To the right of the icon, the operator can view primary instructions such as machine name, feeder slot, the material destination during changeover, and more.

How it works

The Agilis Smart Bin system provides intuitive paperless kitting guidance, based on wireless, electronic labels (e-labels) that communicate with the central data server via a radio base station. Each Agilis Smart Bin is equipped with an e-label that is mechanically attached to the front of the bin.

The MYCenter Material Handling software guides the operator through the entire kitting and changeover process, by presenting instructions on the PC monitor, but also on the e-labels. All actions are confirmed using the hand-held barcode scanner.

Johanna Malmström and Tesfu Woldai represented Mycronic at the award ceremony.

Innovator of the Year award in Employer Branding

Universum, an organisation in Employer Branding Research, Insights and Communication, awarded Mycronic in Sweden as the “Innovator of the Year” for the Employer Branding work we have done during the year and that has led to a higher position in their ranking of Best Employer in Sweden.
 
Universum's motivation to the award:

Innovation is in our DNA

Clemens Jargon and Olivier Pirou from Mycronic and Vi TECHNOLOGY attended the award ceremony.

Two of Mycronic’s solutions received a GLOBAL Technology Award 2019

 
Last night Global SMT & Packaging held their annual Global Technology Award at Productronica, and recognized Mycronic with two awards for being one of the industry’s leading innovators. One for our Jet Printer and SPI inspection machine’s add-on and repair solution and one for Vi TECHNOLOGY’s process control software SIGMA Link.

Award in the category “Printing equipment”

Mycronic’s solder paste add-on and repair solution closes the loop in solder joint quality, achieving zero stencil defects. By combining two innovative products, MY700 Jet Printer and PI 3D SPI, Mycronic has created a breakthrough offering to the SMT industry. It opens new perspectives in terms of quality control of the paste deposition process in a SMT assembly line with high product mix at any production volume.

The jury motivation: “Mycronic’s add-on and repair solution addresses a major need in the industry. It is well documented that up to 70% of defects originate from the stencil printer. Of these defects, the majority are missing solder paste. By automatically verifying the paste deposits and replenishing the missing paste with this verification system, the overall reliability and yield of the line will improve.”

“I am very glad that our innovations are getting attention in the industry. The add-on and repair solution with the jet printer and SPI machine is a unique solution, solving a major issue for our customers,” explains Clemens, VP Global SMT at Mycronic.

Award in the category “Process control system”

The SIGMA Link process control software suite helps to achieve new levels of product quality and SMT process reliability, by leveraging Vi TECHNOLOGY’s SPI and AOI inspection machines. Its real-time data correlation and analysis deliver a unique and powerful tool to take a close control over the manufacturing process, and to visibly increasing First Pass Yield.

The jury motivation: The SIGMA Link software suite takes a holistic approach to monitoring the entire shop floor and monitors any deviations in the process, not only the AOI or SPI data. This, in combination with the ease of programming and easy to follow GUI, were two winning factors.

Solder paste add-on and repair Eliminate stencil printing compromises at any volume with the MY700 3D SPI Add-on and Repair module. Discover how our fully integrated 3D SPI and jet printing solution automatically identifies and fills in missing or damaged solder paste print to help you maintain the highest throughput speeds with simpler stencil designs and zero defects.