Flexible
dispensing platform
Flexible
dispensing platform
Flexible
dispensing platform
high-precision, high-speed
Each product family offers unique value propositions but every product delivers on 4 Key Benefits.
The MRSI-175Ag Epoxy Dispenser handles the most demanding dispensing applications such as microwave modules, optical modules, hybrid circuits, multi-chip modules, and semiconductor packaging. With the ability to operate two heads in tandem, the MRSI-175Ag provides unparalleled process control and comprehensive dispensing capability. Die attach, underfill, encapsulation and multi-pin stamping are all supported on this flexible dispensing platform.
For further details download the product brochure on MRSI's website:
MRSI Systems, part of Mycronic Group, is the leading manufacturer of fully automated, high-speed, high-precision and flexible eutectic and epoxy die bonding systems. We offer “one-stop-shop” die bonding solutions for electronic and photonics industry.
