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Under the MRSI brand, we offer industry-leading die bonders, with superior flexibility, ultra-high-accuracy, and multiple process options. Our product’s' value is further illustrated by our 40+ years of experience in the industry in tandem with our 24/7 reliable field operations.
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History
Service & support
Why do customer's choose MRSI?
Career
Partners
Testimonials
产品介绍
High precision flip-chip die bonders
Submicron Die Bonders
1 micron die bonders
MRSI-LEAP High-Speed Die Bonder
1.5 micron die bonders
3 Micron Die Bonders
5 micron die bonders
High Precision Epoxy Dispensers - MRSI-175Ag
Active Aligners
Prototyping and training services
Prototyping
MRSI Systems Training Services
产品介绍
MRSI values our customers, and our top priority is meeting our customers needs down to the finest detail. We are proud that all of our products are industry-leading, with superior flexibility, ultra-high-accuracy, and multiple process options.
Visit page 产品介绍
High precision flip-chip die bonders
Submicron Die Bonders
1 micron die bonders
MRSI-LEAP High-Speed Die Bonder
1.5 micron die bonders
3 Micron Die Bonders
5 micron die bonders
High Precision Epoxy Dispensers - MRSI-175Ag
Active Aligners
Prototyping and training services
Prototyping
MRSI Systems Training Services
Applications
Photonics
AOC
High Power Laser Diodes
Optical Components & Transceivers
Silicon Photonics
TO-TOSA/ROSA
Microwave & RF
RF Power Amplifier & Microwave Device
Microelectronics
Sensors
LIDAR, AR/VR/MR
Wafer Level Packaging
Applications
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Photonics
AOC
High Power Laser Diodes
Optical Components & Transceivers
Silicon Photonics
TO-TOSA/ROSA
Microwave & RF
RF Power Amplifier & Microwave Device
Microelectronics
Sensors
LIDAR, AR/VR/MR
Wafer Level Packaging
工艺技术
Die bonding
Eutectic die bonding
Epoxy die bonding
工艺技术
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Die bonding
Eutectic die bonding
Epoxy die bonding
设备功能合集
视频合集
图像合集
设备功能合集
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视频合集
图像合集
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MRSI North America
MRSI Automation (Shenzhen) Co., Ltd.
Mycronic Sweden HQ
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Visit our contact page for contact details for our sales and support departments.
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MRSI North America
MRSI Automation (Shenzhen) Co., Ltd.
Mycronic Sweden HQ
Mycronic Global
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News & events
Events
Upcoming
Previously held
7月7日 - 7月10日
San Jose, CA, USA
IMAPS CHIPcon
The leading event for Chiplet and Heterogeneous Integration Packaging (CHIP) technology. Addressing the challenges and opportunities for enabling broader adoption of chiplet architectures. Visit MRSI Mycronic at Table #5.
Die bonding
United States of America
English
9月4日 - 9月6日
Wuxi Taihu International Expo Center
The Innovation Conference on CPO (Co-Packaged Optics)and Heterogeneous Integration Technology
Die bonding
China
English
9月10日 - 9月12日
Shenzhen, China
CIOE – China International Optoelectronic Expo 2025
CIOE is the world’s largest optoelectronics event. Location: Shenzhen World Convention & Exhibition Center Shenzhen, China. MRSI Booth #10B79
Die bonding
China
English
9月29日 - 10月1日
Copenhagen, Denmark
ECOC 2025
The ECOC Exhibition is the key meeting place for everyone in the fibre optic communication technology industry. Booth: #C4315
Die bonding
Denmark
English
9月30日 - 10月1日
San Diego, CA
IMAPS Symposium 2025
The 58th International Symposium on Microelectronics is organized by the International Microelectronics Assembly and Packaging Society and held in San Diego, California. MRSI Booth #607.
Die bonding
United States of America
English
10月7日 - 10月9日
Phoeniz, AZ USA
SEMICON West 2025
SEMICON West includes the extended microelectronics industry supply chain. Booth: #6268
Die bonding
United States of America
English
1月20日, 2026 - 1月22日, 2026
San Francisco, CA USA
SPIE Photonics West 2026
Photonics West is the world’s premier event for lasers, biomedical optics, biophotonics, quantum, and optoelectronics. Booth: #5145
Die bonding
United States of America
English
3月17日, 2026 - 3月19日, 2026
Los Angeles, California, USA
OFC 2026
OFC is the world's largest event for optical networking and communications. South Hall, Booth #822
Die bonding
United States of America
English
2025/6/25 10:15:57