High flexibility solutions
MRSI Systems' family of fully automated, high-speed, high-precision and flexible eutectic and epoxy die bonding systems offers a complete suite of products across the volume spectrum.
Highly flexible solutions
Our solutions remain the standard in the industry delivering 3 and 5 micron accuracy across a complete range of applications. These system delivers an unmatched combination of accuracy, automation, speed and reliability with in-situ assembly processes such as eutectic die bonding, UV epoxy die attach and flip chip assembly (all configurable options).
Both systems have been delivering consistent results in the field over decades.
Two main product families address high flexibility:
Learn more about MRSI
MRSI Systems, part of Mycronic Group, is the leading manufacturer of fully automated, high-speed, high-precision and flexible eutectic and epoxy die bonding systems. We offer solutions for research and development, low-to-medium volume production, and high-volume manufacturing of photonic devices such as lasers, detectors, modulators, AOCs, WDM/EML TO-Cans, Optical transceivers, LiDAR, VR/AR, sensors, silicon photonics, co-packaging optics, 3-D hybrid packaging, and optical imaging products.