High flexibility solutions

MRSI Systems' family of fully automated, high-speed, high-precision and flexible eutectic and epoxy die bonding systems offers a complete suite of products across the volume spectrum.

Highly flexible solutions

Our solutions remain the standard in the industry delivering 3 and 5 micron accuracy across a complete range of applications. These system delivers an unmatched combination of accuracy, automation, speed and reliability with in-situ assembly processes such as eutectic die bonding, UV epoxy die attach and flip chip assembly (all configurable options).

Both systems have been delivering consistent results in the field over decades.

Two main product families address high flexibility:

MRSI-M3

The MRSI-M3 is a 3-Micron Die Bonder optimized for manufacturers of microwave modules, IR sensors, MEMS, multi-chip modules, stacked assemblies, hybrid devices and photonic packages.

MRSI-M3

MRSI-705

The MRSI-705 is 5-Micron Die Bonder optimized for high-precision, high-speed component assembly with the largest installed base in the industry in advanced packaging.

MRSI-705

Learn more about MRSI

MRSI Systems, part of Mycronic Group, is the leading manufacturer of fully automated, high-speed, high-precision and flexible eutectic and epoxy die bonding systems. We offer solutions for research and development, low-to-medium volume production, and high-volume manufacturing of photonic devices such as lasers, detectors, modulators, AOCs, WDM/EML TO-Cans, Optical transceivers, LiDAR, VR/AR, sensors, silicon photonics, co-packaging optics, 3-D hybrid packaging, and optical imaging products.