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About us
Under the MRSI brand, we offer industry-leading die bonders, with superior flexibility, ultra-high-accuracy, and multiple process options. Our product’s' value is further illustrated by our 35+ years of experience in the industry in tandem with our 24/7 reliable field operations.
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MRSI Systems Products
Ultra high precision solutions
High speed solutions
High flexibility solutions
Active alignment solutions
High precision dispensing solutions
MRSI Systems Products
MRSI values our customers, and our top priority is meeting our customers needs down to the finest detail. We are proud that all of our products are industry-leading, with superior flexibility, ultra-high-accuracy, and multiple process options.
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Ultra high precision solutions
High speed solutions
High flexibility solutions
Active alignment solutions
High precision dispensing solutions
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Photonics West 2024
Chiplet Summit 2024
OFC 2024
SEMICON West 2024
IMAPS New England 2024
Compound Semiconductor Conference
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Visit page News & events
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Events
Photonics West 2024
Chiplet Summit 2024
OFC 2024
SEMICON West 2024
IMAPS New England 2024
Compound Semiconductor Conference
Webinars
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MRSI North America
MRSI Automation (Shenzhen) Co., Ltd.
Mycronic Sweden HQ
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Visit our contact page for contact details for our sales and support departments.
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MRSI North America
MRSI Automation (Shenzhen) Co., Ltd.
Mycronic Sweden HQ
Mycronic Global
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MRSI Events
Upcoming Events
Past Events
5月7日
Boxborough, MA, USA
IMAPS New England 2024
International Microelectronics Assembly and Packaging Society (IMAPS) New England 50th Symposium & Expo.
Die bonding
United States of America
English
3月26日 - 3月28日
San Diego, CA USA
OFC 2024
MRSI Booth #1800
Die bonding
United States of America
English
3月20日 - 3月22日
Shanghai New International Expo Center
LASER World of PHOTONICS CHINA 2024
Asia’s largest trade fair for the photonics industry. MRSI Booth #W1.1230
Die bonding
China
Chinese
3月18日 - 3月21日
Fountain Hills, AZ, USA
IMAPS Device Packaging Conference
The 20th Annual Device Packaging Conference (DPC 2024) is an event organized by the International Microelectronics Assembly and Packaging Society (IMAPS). It is a premier event this spring for the microelectronics assembly advanced packaging, that will bring together distinguished industry engineers, researchers, and experts while showcasing the latest developments in photonics and microelectronics. Booth: #55
Die bonding
United States of America
English
3月6日 - 3月8日
Marina Bay Sands Singapore
Asia Photonics Expo 2024
MRSI will exhibit at the Asia Photonics Expo 2024. Booth: EF-23
Die bonding
Singapore
English
2月6日 - 2月8日
Santa Clara, CA USA
Chiplet Summit 2024
MRSI is sponsoring the Second Annual Chiplet Summit at the Santa Clara Convention Center. It is the only event totally dedicated to the skyrocketing chiplet market. Booth #215
Die bonding
United States of America
English
1月30日 - 2月1日
San Francisco, CA USA
Photonics West 2024
Photonics West is the world’s premier event for lasers, biomedical optics, biophotonics, quantum, and optoelectronics. Booth: #5409
Die bonding
United States of America
English
10月3日 - 10月5日
San Diego, CA, USA
IMAPS San Diego 2023
The International Symposium on Microelectronics IMAPS is focused on microelectronics and packaging supply chain technologies. Booth: #621
Die bonding
United States of America
English
10月2日 - 10月4日
Glasgow, Scotland
ECOC
The ECOC Exhibition is the key meeting place for everyone in the fibre optic communication technology industry. Booth: #703
Die bonding
United Kingdom of Great Britain and Northern Ireland
English
10月2日 - 10月5日
Online Event
Automotive LIDAR 2023
Dr. Irving Wang, Director of Marketing, MRSI Systems, Mycronic Group, will present “High-Volume Assembly of Photonics Devices,” on Thursday, October 5th, 2023.
Die bonding
United States of America
English
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2024/05/21 18:41:51