Tailored Packaging Solutions for 3D Sensing Devices
3D sensing devices demand unique packaging solutions due to the diverse and often non-standard requirements of different customers. While sharing similarities with optical communication devices, such as incorporating lasers, photodetectors, optical elements, and IC chips, 3D sensors often involve a higher component count, significantly increasing the complexity of integration.
Enabling Flexible and Customized Packaging
Vanguard Automation’s software-defined solutions for hybrid photonic integration and packaging offer unparalleled flexibility for customers navigating these complex packaging challenges.
Addressing Unique Needs: Our solutions are specifically designed to accommodate the diverse and often non-standard packaging requirements of 3D sensing applications for optical connectivity and integration.
Our portfolio includes:
- Photonic Wire Bonding: For flexible, reliable connections between optical components.
- Facet-Attached Micro-Lenses: Optimizing light coupling efficiency for enhanced performance.
Solving the Integration Challenges of 3D Sensing
We specialize in addressing the unique challenges associated with integrating and packaging hybrid photonic devices, including:
- Photonic Integrated Circuits (PICs)
- Optical Components
- Fiber arrays
- Active devices
In-Situ Optical Connection Manufacturing
Vanguard Automation offers innovative manufacturing processes that allow for the in-situ fabrication of optical connections directly onto optical components.
- Material Compatibility: Our processes are compatible with all commonly used materials for PICs and optical components.
- Wavelength Range: Our solutions support a wide operational range from 530 nm to 2000 nm.
Partner with Vanguard Automation to achieve optimal packaging solutions for your 3D sensing devices, ensuring high performance, reliability, and time-to-market.
Relevant Applications:
- LiDAR
- AR / VR
- Face ID
- Industry 4.0
- Robotics