Webinars

With the continuous electrification of everything, today's high-mix electronics manufacturers have to produce increasingly complex and varied boards, while maintaining a very high level of reliability. And all this in an often uncertain environment that requires even more agility to mitigate risks.

Find out how to prevent print defects from degrading your SMT process with the latest generation of 3D SPI machine.

High-reliability electronics manufacturers, whatever the batch sizes, are keen to implement 3D AOI as long as it doesn't take up their resources nor affect their agility, while still offering industry-leading performance. 

THT and press-fit components are becoming more prevalent in today’s electronics manufacturing, regardless of production volumes. To offer the highest level of reliability to their customers while rationalizing their own capital investment, EMSs and OEMs need to count on a 3D AOI technology versatile and powerful enough to inspect THT and press-fit types of components with the same performance as for regular SMT ones.

Do you know how effective you production processes are? Are you struggling with capacity? What can you do to improve your utilization?

How to get the most out of your Mycronic placement process? With MYCenter Analysis, a new level of performance is in your hands.

The goal of a smart factory or Industry 4.0 project is to improve efficiency, quality and productivity, and to better monitor risks and solve issues by using advanced analytics, software integration, and automation.

The reliability and efficiency of your solder paste deposition process has a direct effect on the performance and profitability of your SMT production line(s). In addition, its capability to handle complex PCBs, with growing component diversity in types and sizes, can positively influence your competitiveness.

In high-mix electronics manufacturing, the way inventories and component flows are managed directly impacts the performance of production lines.