Get more jobs done in less space. Switch effortlessly from full volume to batch size one. And handle a wider range of components with uncompromising production quality, total stock accuracy and complete traceability down to the individual PCB ID. The MY300 delivers new levels of precision and flexibility in a faster, smaller and smarter format.
40% higher space productivity
The new MY300 boosts capacity up to 224 feeder positions within a 40 percent smaller footprint than previous models. At the same time, it enables higher real speeds thanks to built-in board train handling, rolling changeovers and automatic job selection, as well as faster tool changes, which take place while the other head is mounting. This fundamental redesign gives you the maximum possible versatility and utilization from your valuable floor space.
All Mycronic pick-and-place solutions combine rigid machine frames, advanced mounthead technology and Automatic Thermal Adaption for the highest levels of precision. The MY300 adds an improved linescan vision system to take this accuracy into the next generation. It combines three programmable light sources with either 2k or 4k camera resolution to ensure a future-proof solution for the most advanced components down to 0.15 mm pitch.
Expand your component range
Fine-pitch CSPs, FCs or BGAs. From the smallest chip components up to 140 mm long connectors. Or stacked, dipped and entirely new package varieties. Whatever the next job demands, our high-speed mountheads and state-of-the-art vision systems make quick work of them all. Even BGAs can now contain an unlimited number of balls in non-regular patterns, helping you to achieve increased throughput in a wider range of applications.
New operator-friendly design
Now more user-friendly and accessible, the new MY300 platform is designed to make operation and maintenance easier than ever before. The redesigned operator console has improved visibility and ergonomics, ensuring trouble-free access for any type of maintenance work. To further reduce disruptive moments, improved waste tape handling makes it easy to reach and unload waste tape from the back of the machine.
No errors. Less rework.
Electrical verification is performed on the machine’s test surface. Using redundant test patterns, it helps to reduce wear on the contact area while allowing testing of a large range of package types. The process is 100-percent effective at verifying the value of transistors, resistors, capacitors, diodes, and the orientation of active, polarized components. Incorrect components are automatically rejected while the machine continues building the board, thus guaranteeing quality while eliminating time-consuming rework.
With more than 30 years in the electronics industry and a unique market leading position you can count on us. We understand the fast changes in the market and have a strong local presence in over 50 countries to help our customers. We deliver technologies that are future proof and are devoted to our mission and our clients.