News

MRSI Systems Customer Support Team – Ezer Espares

4 Recent Topics in Advanced Packaging

Innovation and new market factors are driving advanced packaging. In this post, we highlight some of the trending topics propelling advanced packaging and ask why now, what problem is the new technology solving, and finally what are the implications.

International Microwave Symposium 2017

ECTC – The 67th Electronic Components and Technology Conference

MRSI Systems is exhibiting at the 67th ECTC focused on the global microelectronics packaging industry.

MRSI Systems Participated in MIT Microphotonics Center / AIM Photonics Spring Technical Meeting in Cambridge

In March 2017, MRSI Systems participated in The MIT Microphotonics Center and AIM Photonics Spring Meeting for Integrated Photonics Manufacturing Meeting.

2017 Optical Fiber Communication Conference and Exhibition (OFC) Highlights

iMAPS New England 44th Symposium and Expo: “The Jetsons 2017”

Hybrid Electronics Technology for Printed Lighting

Several members of the MRSI Systems’ team attended the February iMAPS New England-SMTA Boston Technical presentation by Dr. Adam Scotch—“Challenges of Integrating Printed Electronics into the Lighting Industry.” MRSI Systems has been a long-time supporter of iMAPS. Jon Medernach, Key Account Manager, is the current President of iMAPS New England and has been active with iMAPS New England holding previous positions of Vice President and Technical Chair.

What is the Future of Optoelectronics Packaging?

Innovation in wireless technology leads to faster and smarter networks. 5G and the Internet of Things (IoT) have the capacity to connect everyone and all machines. In this post, we will explain how 5G implementation will enable new advances and challenges in the optoelectronics packaging industry.

How to Choose a Die Bonding System

Leading optoelectronic and semiconductor packaging companies require fully automated, ultra-precision die bonding systems with in-situ capabilities, such as epoxy die attach, eutectic die bonding, and thermo-compression. This post describes the key functionality and therefore the outcomes that advanced packaging companies should demand from their die bonding vendor.

Technology Students Experience Local Advanced Technology Manufacturer Up Close

Join MRSI Systems at OFC!

MRSI is exhibiting at the Optical Fiber Communication Conference and Exhibition (OFC) March 21-23, at the Los Angeles Convention Center (Booth 1728). We invite you to explore MRSI’s product offerings of epoxy and eutectic die bonders by visiting us at the show.

MRSI Systems’ Exceptional Customer Support

After the sale, the real test of a quality business is what happens next. What happens if I have a problem? Can you reach a human being trained in your system who can quickly deal with your issue? The customer support process begins the moment we receive your call or email.  

Challenges in Die Bonding of Gallium Nitride High Power Devices

The gallium nitride (GaN) device market is rising at a compound annual growth rate of (CAGR) of 17.1% according to Mordor Intelligence, implying a rise from $711m to $1.8 billion by 2023.

How Does MRSI Systems Manufacture to Customer’s Specification?

Multiple Die Eutectic Bonding

High Volume Manufacturing of Photonic Components and Modules

Increasing demand for data and bandwidth requires high volume manufacturing (HVM) of photonics devices. This expansion with double-digit growth rates is driven by increased data consumption. The data bandwidth demand from individual consumers and enterprises creates the need to upgrade long haul networks, data centers and metropolitan communication systems.

MRSI Systems Presented at Massachusetts Integrated Photonics Manufacturing Supply Chain Meeting held at MIT in Conjunction with 2016 AIM Photonics / MIT Microphotonics Center Fall Meeting

On November 2, 2016, MRSI Systems participated in the Commercial and Business Opportunities panel discussions at Massachusetts (MA) Integrated Photonics Manufacturing Supply Chain Meeting at MIT. The panel consisted of Analog Devices, MACOM and MRSI Systems, and local MA companies involved in the integrated photonics field. The meeting was part of a series of initiatives under the recently established American Institute of Manufacturing Photonics (AIM Photonics).

Advanced Vision Systems

Advanced Vision Systems — Increasing demand for data and bandwidth requires high-volume manufacturing of photonics and RF electronics at a level we have never seen before. In this post, we examine a specific feature required from these new levels of demand, Advanced Vision Systems.

Challenges in High-Volume Manufacturing for Die Attach Systems

Increasing demand for high-volume manufacturing accelerates the continuing adaptation of full automation in advanced eutectic packaging. From the perspective of potential purchasers of die attach systems, this demand level places both general requirements on them and also very specific requirements from the systems they purchase. The general requirements include the need for lower cost manufacturing (which is difficult given increasing labor costs in popular manufacturing bases, such as in China) and the need for a much higher level of automation in the industry.