Go to main content

IMAPS/GEA Onshoring Workshop

The International Microelectronics Assembly and Packaging Society (IMAPS) along with Global Electronics Association will host a Workshop to discuss and promote strategies to improve On-Shoring Advanced Packaging and Assembly, September 8 - 11, 2025, at the Sheraton Pentagon City Hotel, Arlington, VA. 

9月8日 - 9月11日
Arlington, Virginia, USA
Die bonding
United States of America
English
IMAPS Onshoring Advanced Packaging and Assembly

This workshop will be bringing Government agencies, the DIB (Defense Industrial Base) and Advanced Packaging and Assembly providers together to discuss their efforts to onshore advanced packaging. The mission of this workshop is to engage our workforce community to identify the newly created Advanced Packaging programs which address US Government and Defense requirements critical to the onshoring of the microelectronic assembly and packaging supply chain.  Government agencies including the Department of Commerce/NIST, DoD (SHIP/IBAS/Title III), and DARPA will be briefing on their advanced packaging programs.