MRSI at CIOE 2025: Showcasing the MRSI-LEAP Die Bonder

MRSI is pleased to announce the presentation of its latest innovation, the MRSI-LEAP Die Bonder, at the China International Optoelectronic Expo (CIOE) in Shenzhen, taking place from September 10th to 12th, 2025. Recognized as a leader in precision die bonding, active alignment, and fluid dispensing, MRSI will demonstrate how the MRSI-LEAP delivers high precision and stability for the mass production requirements of AI-driven high-speed optical modules. This advanced die bonder supports a range of epoxy bonding processes, including stamping, dispensing, UV curing, wafer-level packaging and flip-chip assembly. Especially, it has unique multi-die eutectic solutions designed for speed-up 1.6T optical modules delivery.