MRSI-H Family

High speed and flexible
1.5-micron flip-chip die bonders for high volume manufacturing
Advanced high accuracy solution for flexibility and speed

Benefits of MRSI-H Family

The MRSI-H family provides proven superior flexibility for true multi-die, multi-process, multi-product high volume high mix production. These high-speed products deliver the industry-leading speed without sacrificing flexibility, precision or reliability. The MRSI-H family targets the manufacturing challenges driven by AI cluster expansion, wireless network rollout and LIDAR market for autonomous driving. MRSI reclassified H series by application.

MRSI-H-LD

This standard system is widely used in advanced photonics such as lasers, receivers, transceivers, lighting, and sensors, etc.
Carries key technological building blocks from our field-proven, flexible and high-speed MRSI-HVM platform
Heated head option designed for the higher density eutectic packaging
“On-the-fly” patented auto tool changer has twelve vacuum tips/collets integrated on the bonding head for zero time tool change

MRSI-H-TO

Specifically designed for handling multi-dies and multi-processes for complex TO products without tool changeover. e.g. TO-based EMLs and WDM LDs for 5G
TO handling module combined with pick and place head for dual parallel processing
Capability of both epoxy and eutectic die bonding in one process flow

Value to our Customers

Industry leading throughput, superior flexibility, and ultra-high-accuracy in high-volume, high-mix manufacturing
Easy to use icon-based interface running on a Windows™ platform for ease of programming, and low-cost machine maintenance.
Industry leading local technical support teams and application expertise
40+ years of experiences in the industry with reliable 24/7 field operation