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About us
Under the MRSI brand, we offer industry-leading die bonders, with superior flexibility, ultra-high-accuracy, and multiple process options. Our product’s' value is further illustrated by our 35+ years of experience in the industry in tandem with our 24/7 reliable field operations.
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High precision dispensing solutions
Active alignment solutions
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MRSI values our customers, and our top priority is meeting our customers needs down to the finest detail. We are proud that all of our products are industry-leading, with superior flexibility, ultra-high-accuracy, and multiple process options.
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High precision dispensing solutions
Active alignment solutions
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Photonics West 2024
Chiplet Summit 2024
OFC 2024
SEMICON West 2024
IMAPS New England 2024
Compound Semiconductor Conference
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Visit page News & events
Press releases
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Events
Photonics West 2024
Chiplet Summit 2024
OFC 2024
SEMICON West 2024
IMAPS New England 2024
Compound Semiconductor Conference
Webinars
Contact us
MRSI North America
MRSI Automation (Shenzhen) Co., Ltd.
Mycronic Sweden HQ
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Visit our contact page for contact details for our sales and support departments.
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MRSI North America
MRSI Automation (Shenzhen) Co., Ltd.
Mycronic Sweden HQ
Mycronic Global
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MRSI Events
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Past Events
7 mai
Boxborough, MA, USA
IMAPS New England 2024
International Microelectronics Assembly and Packaging Society (IMAPS) New England 50th Symposium & Expo.
Die bonding
United States of America
English
22 mai - 23 mai
Suzhou, China
Compound Semiconductor Conference
Dr. Limin Zhou to present “A New Engine for the Development of Photonics Industry – Generative AI”
Die bonding
United States of America
English
18 juin - 20 juin
Washington, DC, USA
IMS - International Microwave Symposium 2024
IMS is focused on the microwave industry. MRSI Booth: #1649 Walter E. Washington Convention Center, Washington, DC, USA
Die bonding
United States of America
English
9 juillet - 11 juillet
San Francisco, CA USA
SEMICON West 2024
SEMICON West includes the extended microelectronics industry supply chain. MRSI Booth: South Hall #764
Die bonding
United States of America
English
27/04/2024 16:42:20