Die bonding

About us
- History
About us

Under the MRSI brand, we offer industry-leading die bonders, with superior flexibility, ultra-high-accuracy, and multiple process options. Our product’s' value is further illustrated by our 35+ years of experience in the industry in tandem with our 24/7 reliable field operations.
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- History
Products
- High precision dispensing solutions
- Active alignment solutions
Products

MRSI values our customers, and our top priority is meeting our customers needs down to the finest detail. We are proud that all of our products are industry-leading, with superior flexibility, ultra-high-accuracy, and multiple process options.
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- High precision dispensing solutions
- Active alignment solutions
Service & support
Case
Career
News & events
News & events
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Contact us
Contact us

Visit our contact page for contact details for our sales and support departments.
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7 septembre

Shenzhen, China

China

English

CIOE Conference

Location: Shenzhen, China Dr. Limin Zhou will present “The Evolution and Trends of Optoelectronic Chip Packaging in the AI Era” during the Optoelectronic Chip Design, Manufacturing and Packaging Technology Forum.

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