Dr. Limin Zhou to present at the Semiconductor Advanced Technology Innovation Development and Opportunities Conference

The rapid adoption of artificial intelligence is driving advancements in optical interconnect technology, resulting in notable improvements in speed, power efficiency, and cost reduction. This progress necessitates the development of sophisticated optoelectronic packaging solutions, thereby creating new opportunities for processes and equipment.

Dr. Limin Zhou will elaborate on the latest trends and opportunities in this field while introducing MRSI’s fully localized, high-speed, high-precision optoelectronic packaging solutions.

Learn more here:

https://www.compoundsemiconductorchina.net/suzhou/