MRSI-LEAP High-Speed Die Bonders

Applications & Features 

• Flip-chip bonding, UV epoxy dispensing, in-situ UV curing, wafer-level packaging, and other processes are available
• Ultra-high placement accuracy achieved via intelligent motion control and high resolution vision alignment
• Unmatched Throughput: Automated material handling and smart multi-tool switching system
• Supports multiple epoxy bonding processes including stamping, dispensing, UV curing, and flip-chip assembly
• Proprietary Multi-die Eutectic Bonding: Solves double reflow issues in multi-die heating processes for reliable bonding
• Broad application compatibility: Suitable for AI optical modules, silicon photonics, LiDAR systems, and optical sensing applications

Value to our Customers 

• Industry-leading throughput and ultra-high accuracy in high-volume manufacturing, with a pick-and-place process capable of achieving over 1,000 units per hour (UPH)
• Easy to use icon-based interface running on a Windows™ platform for ease of programming, and low-cost machine maintenance
• Industry-leading local technical support teams and application expertise
• 40+ years of experience in the industry with reliable 24/7 field operation

Configuration Highlights

• Advanced machine vision and tool design
• Modular design and field upgradeable
• Supports two 8-inch wafers and two 6-inch wafers
• Built-in conveyor and magazine design for high efficiency and throughput
• Automated dispensing and UV cure options available