TO-TOSA/ROSA

For TO header products, the laser chip and other die are attached onto a TO base or the vertical post after flipping 90°. To support upcoming 5G wireless deployment, wavelength-division multiplexing (WDM) lasers and electro-absorption modulated lasers (EMLs) are packaged with low-cost TO-headers. These WDM/EML-TOs require the attach of many die and are far more complicated than traditional TO headers that have only 1–2 die. These new TO based devices demand a new class of high-speed die bonder that is capable of multi-die and multi-process production in one machine to achieve the best throughput.