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September 2024

Feature of the Month: Adjustable Conveyor

MRSI Spotlight: Laser Focus World Webinar

New West Coast Demo Center in CA

Para Athlete Sponsorship 

Trade Show News

Blog Insights

August 2024

New Feature of the Month: Head-mounted UV systems

Application Note: Dispense Needle Auto Calibration Set-up

Upcoming Events

Blog Insights

July 2024

Featured Product of the Month: MRSI-A-L

MRSI Spotlight: Italy Demo Center

Upcoming Events - CIOE, IFOC, ECOC

Blog Insights

June 2024

Featured Product of the Month: MRSI-175Ag Epoxy Dispenser

Customer Support & Training 

MRSI Spotlight: Sustainability

Trade Show News

Blog Insights

May 2024

Featured Product of the Month: MRSI-705

MRSI Spotlight

Upcoming Events

Blog Insights

April 2024

 Featured Product of the Month – The MRSI-H1 Family: Unleashing Precision and Agility

MRSI Spotlight

Upcoming Events

Blog Insights

March 2024

Featured Product of the Month – MRSI-A-L Active Aligner

MRSI Spotlight: Trade Show Highlights – March

Upcoming Events in May

Blog Insights

February 2024

Featured Product of the Month – MRSI-H1

Training Services

MRSI Spotlight

Upcoming Trade Shows

Blog Insights

January 2024

Wafer-level Packaging

Infostone Award: MRSI-705HF

MRSI Spotlight

Happy Chinese New Year

Trade Show News

Blog Insights

2023 

November 2023

Advanced Packaging for Heterogeneous Integration

MRSI Spotlight

Training Programs

Trade Show News

Blog Insights

October 2023

Feature of the Month: Automatic tool changing turret

Prototyping Services

Trade Show News

Blog Insights

September 2023

Product of the Month: MRSI-705HF High Force

MRSI Spotlight

Trade Show News

Blog Insights

August 2023

Featured Product of the Month: MRSI-705

MRSI Spotlight

Trade Show News

Blog Insights

July 2023

Feature of the Month

Training Programs

Trade Shows

Blog Insights

June 2023

Feature of the Month

MRSI Spotlight

Training Programs

Software Training Videos Update

Trade Shows

Blog Insights

May 2023

Product Tip of the Month

MRSI Spotlight

Software Training Videos Update

Customer Support & Training Programs

Trade Shows

Blog Insights

April 2023

Machine Tip of the Month

MRSI Employee Spotlight – Francesca Lynch

Software Training Video Update

Smash The Trash! – Sustainability

Trade Shows Updates

Blog Insights

March 2023

Software Training Video Announcement

MRSI Spotlight

Machine Tip of the month

Upcoming Events

OFC & IMAPS Reflections

February 2023

OFC

Optica

PSC

IMAPS Device Packaging

SPIE Photonics West Reflections 2023

Blog Insights

January 2023

Infostone Award

Trade Show News

Happy Chinese New Year

Blog Insights

2022 

December 2022

Season’s greetings

November 2022

CIOE Dec 7-9 (New Date)

Infostone Conference Dec 5-6 (New Date)

LIDAR Tech Nov 16-18

Blog Insights

October 2022

IMAPS Boston Oct 4-5

ECOC Virtual Catch Up Oct 11-13

LiDAR Tech Nov 16-18

Blog Insights

September 2022

9/19-9/21 European Conference on Optical Communication

9/20-9/22 Automotive LIDAR – Dr. Limin Zhou to present

9/27-9/29 European Microwave Week

10/4-10/5 IMAPS Boston

Blog Insights

August 2022

9/5-9/6 Infostone Optical Communication & Market Technology Conference – Dr. Limin Zhou to present

9/7-9/9 CIOE – MRSI is exhibiting with live demos

9/8 CIOE Conference – Dr. Limin Zhou to present

Blog Insights

July 2022

CSC August 3-4th

LaserFocusCon August 30th

CIOE September 7-9th

Blog Insights

June 2022

SEMICON West

International Microwave Symposium

Compound Semiconductor Conference

Blog Insights

May 2022

VPT Components and MRSI Systems jointly address manufacturing challenges

ECTC June 1-3

IMS June 21-23

Blog Insights

April 2022

MRSI to exhibit at LASER World of PHOTONICS Munich – April 26-29

MRSI is presenting and sponsoring the iMAPS New England 48th Symposium and Expo – May 3

MRSI (Mycronic集团)周利民博士接受《化合物半导体》的高端访谈

Trade Show News

Blog Insights

March 2022

MRSI is presenting at the 2022 ATC Webinar on Vehicle LIDAR Manufacturing – March 17th

Trade Show News– LaserFocusCon April 19th, Laser World of Photonics Munich – April 26-29th

Blog Insights

February 2022

Join MRSI at the upcoming events

Trade Show News - OFC March 8-10th, IMAPS Device Packaging March 8-9th

Blog Insights

January 2022

MRSI-H-TO 1.5 micron Die Bonder Won the Award for “Infostone 2022 Outstanding Technology”

Visit MRSI at SPIE Photonics West – January 25-27, 2022

Trade Show News – OFC March 8-10, 2022, IMAPS Device Packaging March 8-9, 2022

Blog Insights

2021 

December 2021

Season’s greetings

November 2021

Visit MRSI at SEMICON West in San Francisco – December 7-9, 2021

MRSI to present at the LiDAR Tech Conference in Shanghai, China – December 9-10, 2021

BRIDGE

Trade Show News

Blog Insights

October 2021

MRSI joins EPIC

Bruno Afonso joins MRSI – Sales

Trade Show News OVC Expo, CHInano, Productronica

Blog Insights

September 2021

MRSI to Sponsor and Exhibit at the International Microelectronics Assembly and Packaging Society (IMAPS) Symposium – October 11-14, 2021

MRSI-705 New Configuration for Higher Speed & Volume

MRSI received the 2021 CIOE Silver Award for the MRSI-HVM Die Bonder

Blog Insights

September 2021

MRSI to present at Yole-CIOE Forum 2021

MRSI to present at IFOC 2021

Blog Insights

August 2021

MRSI opens a new Product Demo Center in China, will present at the Infostone Conference and attend CIOE with live demos

MRSI Shenzhen Demo Center grand opening ceremony

Blog Insights

Volume XXX

Automating RF PA device manufacturing to accelerate 5G wireless rollout
as published in Chip Scale Review

Volume LXV

MRSI-S-HVM Submicron Die Bonder won the award for “Infostone 2020 The Most Competitive Optical Communications Product”

Happy Chinese New Year

Trade Show News

Blog Insights

Volume LXIV

Mycronic technology essential in 5G development

Trade Show News

Blog Insights

2020 

December 2020

Season’s Greetings

Volume LXIII

MRSI-705 innovative high-volume configuration for lower cost manufacturing

Blog Insights

Volume LXII

CIOE 2020 & IFOC 2020 Highlights

Trade Show News

Blog Insights

Volume LXI

MRSI launches submicron die bonding solution for silicon photonics, co-packaging, and wafer-level packaging

MRSI’s New Products

Trade Show News

Blog Insights

Volume LX

Published Article: Laser Focus World Featured Article: Assembly solution addresses TO-can photonic device manufacturing challenges

Video Updates: MRSI-H-LD Die Bonder

PR Latest: MRSI to present at IFOC and attend CIOE in September in Shenzhen including live product demos

Blog Insights: MRSI solves one of the greatest challenges in modern photonics manufacturing

Volume LIX

Trade Show News

Blog Insights

Volume LVIII

LASER World of PHOTONICS CHINA

Chinese Press Release: MRSI Systems赢得长期诉讼, Palomar的 “Double Pick” 专利权被判无

Trade Show News

Blog Insights

Volume LVII

HPLD Die Bonding Process Challenges

High-power Laser Diodes Chinese Article: 应用于大功率激光器单管和Bar条芯片封装的贴片解决方案

Trade Show News

Blog Insights

Volume LVI

Visit MRSI at LASER World of PHOTONICS CHINA 2020

Video – MRSI-H/HVM Die Bonders

Trade Show News

Blog Insights

Volume LV

Laser Focus World Featured Article: Die-bonder innovations target HPLD manufacturing challenges

Trade Show News

Blog Insights

Volume LIV

MRSI Named in the 2019 Infostone Top Honors List in China, with the MRSI-HVM Series Receiving the Award for the Most Competitive Product for Optical Communications

Trade Show News

Blog Insights

2019 

Volume LIII

MRSI Is Moving to Our New State-of-the-Art Facility

Customer Support and Training Programs

Trade Show News

Blog Insights

Volume LII

Visit MRSI at Productronica

Trade Show News

Blog Insights

Volume LI

Automotive LIDAR Conference and Exhibition 2019

MRSI to Sponsor and Exhibit at the 2019 International Symposium on Microelectronics

CIOE and Infostone Conference – Announcement of the Latest Advancement in the 1.5 Micron MRSI-H/HVM-series Product Line

Blog Insights

Volume L

MRSI to Present at 18th ICCSZ OC Market and Technology Seminar and Offer Die Bonder Demonstrations at CIOE

Visit MRSI at CIOE

MRSI Systems Welcomes Hendry He as China Country Sales Director

Blog Insights

Volume XLIX

Visit MRSI Systems Demonstration Center in Shenzhen – Mycronic Facility

Trade Show News

Blog Insights

Volume XLVIII

Flexible Automation Solutions to Accelerate LiDAR Automotive Applications

Trade Show News

Blog Insights

Volume XLVII

Visit MRSI at IMS in Boston

Trade Show News

Blog Insights

Volume XLVI

IMAPS New England 

Trade Show News

Blog Insights

Volume XLV

Challenges and Solutions for Bonding Ultra-Small Ceramic End-Terminated Capacitors

Trade Show News

Blog Insights

Volume XLIV

Visit MRSI Systems at OFC in San Diego

Trade Show News

Blog Insights

Volume XLIII

MRSI-H3LD for High Power Laser Diodes

Trade Show News

Blog Insights

2018 

Volume XLII

Holiday Greetings from MRSI Systems

Trade Show News

Blog Insights

Volume XLI

MRSI Announces HVM3 Die Bonding Demonstration Capability in Shenzhen China

Customer Support

Trade Show News

Blog Insights

Volume XL

MRSI-HVM3 Family Expansion

MRSI-H3 High Speed Die Bonder Video

Trade Show News

Blog Insights

Volume XXXIX

Manufacturing Automation Case Study-Flexible High-Speed Die Bonding Automation Platform 

Trade Show News

Blog Insights

Volume XXXVIII

MRSI Systems – “One Stop Shop” Product Demo at CIOE

Laser Focus World: Challenges for photonics manufacturing in the new data center era

Trade Show News

Volume XXXVII

MRSI Systems is Acquired by Mycronic AB

Trade Show News

Blog Insights

Volume XXXVI

Challenges in Die Bonding of Gallium Nitride High Power Devices

Customer Support and Training Programs

Scale with Us

Trade Show News

Blog Insights

Volume XXXV

Building Complex Hybrid Circuits-Advanced Packaging

Trade Show News

Blog Insights

Volume XXXIV

MRSI Systems Launches New Software Video Training Programs

Trade Show News – Visit MRSI at OFC in San Diego March 11-15

MRSI-M3 Epoxy Stamping Video

Blog Highlights

Volume XXXIII

New Product Spotlight MRSI-HVM3

New Website Process Pages

Trade Show News – Visit MRSI at OFC in San Diego March 11-15

Webinar New Insights – Watch the MRSI Webinar: The Challenges in High Volume Manufacturing of
Photonic Devices for Data Center Applications

Volume XXXII

MRSI Systems – IEEE Tech Insider Webinar January 25th: The Challenges in High Volume Manufacturing of Photonic Devices for Data Center Applications

High-volume manufacturing (HVM) of chip-on-submount (CoS): challenges and solutions – Chinese Version

MRSI Systems’ Story

Visit MRSI in San Francisco – SPIE Photonics West

MRSI Blog – Weekly Insights into the Advanced Electronic Packaging Industry

2017

Volume XXXI

Best Holiday Wishes from MRSI Systems

Watch the MRSI-705, 5 Micron Die Bonder Video

MRSI Blog – Weekly Insights into the Advanced Electronic Packaging Industry

Volume XXX

MRSI Systems Receives Funding from State of Massachusetts for Advanced Manufacturing Initiative 

High Volume Manufacturing of Photonic Devices: Assembly Starts with Design

MRSI Blog – Weekly Insights into the Advanced Electronic Packaging Industry

Volume XXIX

Assembly Solutions

Visit MRSI Systems at Productronica in Munich, Germany

MRSI Blog – Weekly Insights into the Advanced Electronic Packaging Industry

Volume XXVIII

MRSI is Sponsoring IMAPS 2017 — Raleigh, IMAPS 50th Anniversary Symposium

Visit MRSI at Productronica

CIOE – Big Success with Introduction of MRSI-HVM3

Volume XXVII

MRSI to Exhibit at CIOE

Upcoming Events: ECOC, Sweden, September 18-20 and Electronics Packaging Symposium, NY, September 19-20

Volume XXVI

Read our Latest Article in Chip Scale Review: High-volume manufacturing (HVM) of chip-on-submount (CoS): challenges
and solutions

Upcoming Events: China International Optoelectronic Expo September 6-9 and ECOC September 18-20

Volume XXV

MRSI Systems is Exhibiting at Semicon West

Customer Visits

MRSI Blog – Weekly Insights into the Advanced Electronic Packaging Industry

Volume XXIV

MRSI-M3 Die Bonder Video

MRSI Sponsors FIRST Robotics Team

Customer Visits

Volume XXIII

Case Study – MRSI Systems Automated Microwave Hybrid Manufacturing at TESAT-Spacecom (TESAT) 

TESAT’s challenge was to develop an “Automated Microwave Factory” to manufacture complex highly integrated LTCC microwave modules within the frequency range 2 to 77GHz, 24 hours per day including a manless overnight ghost shift

Our Chinese Website Launch

Volume XXII

Our latest blog post: Challenges in Die Bonding of Gallium Nitride High Power Devices

Gallium Nitride (GaN) materials have long been regarded as great alternatives and enhancements to GaAs and silicon-based counterparts for applications demanding high power and high frequency performance

Upcoming Conferences

Volume XXI

Our latest blog post: High Volume Manufacturing of Photonic Components and Modules.

In this post we discuss: Increasing demand for data and bandwidth requires high volume manufacturing (HVM) of photonics devices.

2016 

Volume XX

Best Holiday Wishes from MRSI Systems

We wish you a very Happy Holiday season and a peaceful and prosperous New Year.

High Volume Manufacturing (HVM) of Chip on Submount (CoS)

Volume XIX

New Website Launch

This month we launched our new website to celebrate our product family, share some great new technical content, and introduce you to our team.

Volume XVIII

Advance Eutectic Packaging for Volume Manufacturing of Photonic, Microwave and RF Electronics

Eutectic bonding is an area of particular interest in photonics, microwave and RF electronics, due to the need for a clean, highly thermally efficient process and for long-term reliability.

Volume XVII

MRSI Systems Provides MRSI-M3 Die Bonding Assembly Work Cell to Fabrinet

MRSI Systems Provides MRSI-M3 Die Bonding Assembly Work Cell to Fabrinet in Silicon Valley for Fast Prototyping and New Product Introduction.

Volume XVI

Die Bonding with Integrated In Situ UV Curing

One challenge in building photonic devices such as Active Optical Cables (AOC) is to ensure extremely accurate post die bond positioning of lenses or other critical devices.

Volume XV

Automated Material Traceability

Material traceability information is important for automotive components, medical devices, government contracts, aerospace & defense electronics and advanced manufacturing systems.

2015 

Volume XIV

Best Holiday Wishes

We wish you a happy holiday season and a peaceful and prosperous New Year.

Volume XIII

Device Flipping Mechanisms & Eutectic Stages & TO Can Package

Certain devices, especially optical parts, require a 90 degree change in orientation after pick up.

Volume XII

Achieving Accurate Global and Local Alignments

Having a proven ultra-accurate machine platform that is mechanically and thermally stable, with no cantilevered parts, is a baseline to achieve accurate device placement.

Volume XI

Automatic In-line Eutectic Die Bonding

Applications, such as RF Power devices, require high speed solutions which include automated in-line material handling with integrated eutectic die attach capability.

Volume X

Handling Large Aspect Ratio, Thin, Delicate Die

Many applications including RF Power, Optical and MEMS require large, thin, high aspect ratio devices. Aspect ratios can exceed 45 to 1.

Volume IX

AOC Die Bonder Integrated with In Situ Light Measurement

One challenge in building photonic devices, such as Active Optical Cables (AOC), is to ensure proper light coupling as early in the manufacturing process as possible.

Volume VIII

MRSI Sponsors First Robotics Team

FIRST® is an international not-for-profit organization founded by inventor Dean Kamen to inspire young people’s interest and participation in science, technology, engineering, and math).

Volume VII

MRSI Expands Customer Support Organization

To meet the demand of our rapidly expanding business, MRSI has been building up our customer support organization that is managed by Peter Cronin.

2014 

December 2014

Die Bonding of Silicon Photonic Devices

Silicon photonics is an evolving technology in which data is transferred via light. Photons can carry far more data in less time than electrons providing scalable solutions for expanding data communication needs worldwide.

October 2014

Precision Dispensing of Conductive Epoxy

MRSI Systems, a leading manufacturer of dispense and assembly equipment for semiconductor and photonic packaging, is now offering its industry leading MRSI-175Ag with a Rotary Style Positive Displacement Pump with a new higher resolution motor….

July 2014

MRSI Systems now offers its flagship MRSI-M3 Assembly Work Cell configured to 1-micron placement accuracy!

MRSI Systems, a leading manufacturer of semiconductor and optical assembly systems, is now offering its well-established M3 work cell with 1 micron placement accuracy…

May 2014

MRSI Systems Announces 2.5D/3D Thermo Compression Bonder

MRSI Systems has been in development of an automated system and processes for thermo compression bonding that enables new methods of assembling semiconductor devices…

April 2014

Active Optical Cables (AOC) Assembly

Active Optical Cables (AOC) technology is a cabling methodology that accepts the same electrical input as traditional copper cables, but utilizes optical fiber between the connectors…

January 27th 2014

MRSI Systems Acquisition is Completed

Today, we announce some exciting news as we enter the next chapter of our successful thirty year long history. The acquisition from Newport Corporation of MRSI Systems, a company established by the existing management team, is completed as of January 24, 2014…

January 10th 2014

Fast Ramp Eutectic Die Attach

Our systems are considered the industry standard for eutectic bonding. This capability includes the addition of a eutectic reflow station with fast temperature ramping capability…

2013

November 2013

Newport to Sell All Shares of MRSI to a Team of Current Management

MRSI was founded in 1984 and has remained focused on providing our customers with the highest quality services and solutions. On January 23, 2002 MRSI announced an agreement to be acquired by Newport Corporation…

October 2013

Servo Drive of Needle Mechanism Synchronized with Pick Up Collet

Thin die handling has become a common need among customers building high performance packages. MRSI is known as a leader in the industry for handling thin die…

August 2013

Real Time Video Provides Process Monitoring for Dispense and Assembly:

Real time video is available to monitor the dispense and assembly process on the Newport MRSI family of Dispense and Die Bonders…

July 2013

Applications Corner

The MRSI-705 Assembly Workcell continues to set new industry standards for ultra-precise, high-speed component assembly…

June 2013

The Importance of Proper Lighting

Lighting is an important component of any vision recognition system. When it comes to lighting it is not a case of “one size fits all”…

May 2013

Dispensing Solutions Update

MRSI Systems has been busy adding new dispense features to the MRSI-175Ag Precision Dispense System and the dispensing options on our family of die bonders…

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By submitting this form, you are consenting to receive marketing emails from: MRSI Mycronic, 554 Clark Road, Tewksbury, MA, 01876, US. You can revoke your consent to receive emails at any time by using the Safe Unsubscribe® link, found at the bottom of every email. Emails are serviced by Constant Contact. 

Submitting means that you consent to having your personal data processed in accordance with the privacy policy