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Newsletters archive
September 2024
Feature of the Month: Adjustable Conveyor
MRSI Spotlight: Laser Focus World Webinar
New West Coast Demo Center in CA
Para Athlete Sponsorship
Trade Show News
Blog Insights
August 2024
New Feature of the Month: Head-mounted UV systems
Application Note: Dispense Needle Auto Calibration Set-up
July 2024
Featured Product of the Month: MRSI-A-L
MRSI Spotlight: Italy Demo Center
Upcoming Events - CIOE, IFOC, ECOC
Blog Insights
June 2024
Featured Product of the Month: MRSI-175Ag Epoxy Dispenser
Customer Support & Training
MRSI Spotlight: Sustainability
Trade Show News
Blog Insights
May 2024
Featured Product of the Month: MRSI-705
MRSI Spotlight
Upcoming Events
Blog Insights
April 2024
Featured Product of the Month – The MRSI-H1 Family: Unleashing Precision and Agility
MRSI Spotlight
Upcoming Events
Blog Insights
March 2024
Featured Product of the Month – MRSI-A-L Active Aligner
MRSI Spotlight: Trade Show Highlights – March
Upcoming Events in May
Blog Insights
February 2024
Featured Product of the Month – MRSI-H1
Training Services
MRSI Spotlight
Upcoming Trade Shows
Blog Insights
January 2024
Infostone Award: MRSI-705HF
MRSI Spotlight
Happy Chinese New Year
Trade Show News
Blog Insights
2023
November 2023
Advanced Packaging for Heterogeneous Integration
MRSI Spotlight
Training Programs
Trade Show News
Blog Insights
October 2023
Feature of the Month: Automatic tool changing turret
Prototyping Services
Trade Show News
Blog Insights
September 2023
Product of the Month: MRSI-705HF High Force
MRSI Spotlight
Trade Show News
Blog Insights
August 2023
Featured Product of the Month: MRSI-705
MRSI Spotlight
Trade Show News
Blog Insights
July 2023
Training Programs
Trade Shows
Blog Insights
June 2023
MRSI Spotlight
Training Programs
Software Training Videos Update
Trade Shows
Blog Insights
May 2023
MRSI Spotlight
Software Training Videos Update
Customer Support & Training Programs
Trade Shows
Blog Insights
April 2023
Machine Tip of the Month
MRSI Employee Spotlight – Francesca Lynch
Software Training Video Update
Smash The Trash! – Sustainability
Trade Shows Updates
Blog Insights
March 2023
Software Training Video Announcement
MRSI Spotlight
Machine Tip of the month
Upcoming Events
OFC & IMAPS Reflections
February 2023
Optica
PSC
IMAPS Device Packaging
SPIE Photonics West Reflections 2023
Blog Insights
January 2023
Trade Show News
Happy Chinese New Year
Blog Insights
2022
December 2022
November 2022
Infostone Conference Dec 5-6 (New Date)
LIDAR Tech Nov 16-18
Blog Insights
October 2022
ECOC Virtual Catch Up Oct 11-13
LiDAR Tech Nov 16-18
Blog Insights
September 2022
9/19-9/21 European Conference on Optical Communication
9/20-9/22 Automotive LIDAR – Dr. Limin Zhou to present
9/27-9/29 European Microwave Week
10/4-10/5 IMAPS Boston
Blog Insights
August 2022
9/5-9/6 Infostone Optical Communication & Market Technology Conference – Dr. Limin Zhou to present
9/7-9/9 CIOE – MRSI is exhibiting with live demos
9/8 CIOE Conference – Dr. Limin Zhou to present
Blog Insights
July 2022
LaserFocusCon August 30th
CIOE September 7-9th
Blog Insights
June 2022
International Microwave Symposium
Compound Semiconductor Conference
Blog Insights
May 2022
VPT Components and MRSI Systems jointly address manufacturing challenges
ECTC June 1-3
IMS June 21-23
Blog Insights
April 2022
MRSI to exhibit at LASER World of PHOTONICS Munich – April 26-29
MRSI is presenting and sponsoring the iMAPS New England 48th Symposium and Expo – May 3
MRSI (Mycronic集团)周利民博士接受《化合物半导体》的高端访谈
Trade Show News
Blog Insights
March 2022
MRSI is presenting at the 2022 ATC Webinar on Vehicle LIDAR Manufacturing – March 17th
Trade Show News– LaserFocusCon April 19th, Laser World of Photonics Munich – April 26-29th
Blog Insights
February 2022
Join MRSI at the upcoming events
Trade Show News - OFC March 8-10th, IMAPS Device Packaging March 8-9th
Blog Insights
January 2022
MRSI-H-TO 1.5 micron Die Bonder Won the Award for “Infostone 2022 Outstanding Technology”
Visit MRSI at SPIE Photonics West – January 25-27, 2022
Trade Show News – OFC March 8-10, 2022, IMAPS Device Packaging March 8-9, 2022
Blog Insights
2021
December 2021
November 2021
Visit MRSI at SEMICON West in San Francisco – December 7-9, 2021
MRSI to present at the LiDAR Tech Conference in Shanghai, China – December 9-10, 2021
BRIDGE
Trade Show News
Blog Insights
October 2021
Bruno Afonso joins MRSI – Sales
Trade Show News OVC Expo, CHInano, Productronica
Blog Insights
September 2021
MRSI-705 New Configuration for Higher Speed & Volume
MRSI received the 2021 CIOE Silver Award for the MRSI-HVM Die Bonder
Blog Insights
September 2021
MRSI to present at Yole-CIOE Forum 2021
MRSI to present at IFOC 2021
Blog Insights
August 2021
MRSI Shenzhen Demo Center grand opening ceremony
Blog Insights
Volume XXX
Automating RF PA device manufacturing to accelerate 5G wireless rollout
as published in Chip Scale Review
Volume LXV
Happy Chinese New Year
Trade Show News
Blog Insights
Volume LXIV
Mycronic technology essential in 5G development
Trade Show News
Blog Insights
2020
December 2020
Volume LXIII
MRSI-705 innovative high-volume configuration for lower cost manufacturing
Blog Insights
Volume LXII
CIOE 2020 & IFOC 2020 Highlights
Trade Show News
Blog Insights
Volume LXI
MRSI’s New Products
Trade Show News
Blog Insights
Volume LX
Video Updates: MRSI-H-LD Die Bonder
PR Latest: MRSI to present at IFOC and attend CIOE in September in Shenzhen including live product demos
Blog Insights: MRSI solves one of the greatest challenges in modern photonics manufacturing
Volume LIX
Trade Show News
Blog Insights
Volume LVIII
LASER World of PHOTONICS CHINA
Chinese Press Release: MRSI Systems赢得长期诉讼, Palomar的 “Double Pick” 专利权被判无
Trade Show News
Blog Insights
Volume LVII
HPLD Die Bonding Process Challenges
High-power Laser Diodes Chinese Article: 应用于大功率激光器单管和Bar条芯片封装的贴片解决方案
Trade Show News
Blog Insights
Volume LVI
Visit MRSI at LASER World of PHOTONICS CHINA 2020
Video – MRSI-H/HVM Die Bonders
Trade Show News
Blog Insights
Volume LV
Laser Focus World Featured Article: Die-bonder innovations target HPLD manufacturing challenges
Trade Show News
Blog Insights
Volume LIV
Trade Show News
Blog Insights
2019
Volume LIII
MRSI Is Moving to Our New State-of-the-Art Facility
Customer Support and Training Programs
Trade Show News
Blog Insights
Volume LII
Trade Show News
Blog Insights
Volume LI
Automotive LIDAR Conference and Exhibition 2019
MRSI to Sponsor and Exhibit at the 2019 International Symposium on Microelectronics
CIOE and Infostone Conference – Announcement of the Latest Advancement in the 1.5 Micron MRSI-H/HVM-series Product Line
Blog Insights
Volume L
MRSI Systems Welcomes Hendry He as China Country Sales Director
Blog Insights
Volume XLIX
Visit MRSI Systems Demonstration Center in Shenzhen – Mycronic Facility
Trade Show News
Blog Insights
Volume XLVIII
Flexible Automation Solutions to Accelerate LiDAR Automotive Applications
Trade Show News
Blog Insights
Volume XLVII
Trade Show News
Blog Insights
Volume XLVI
Trade Show News
Blog Insights
Volume XLV
Challenges and Solutions for Bonding Ultra-Small Ceramic End-Terminated Capacitors
Trade Show News
Blog Insights
Volume XLIV
Visit MRSI Systems at OFC in San Diego
Trade Show News
Blog Insights
Volume XLIII
MRSI-H3LD for High Power Laser Diodes
Trade Show News
Blog Insights
2018
Volume XLII
Holiday Greetings from MRSI Systems
Trade Show News
Blog Insights
Volume XLI
MRSI Announces HVM3 Die Bonding Demonstration Capability in Shenzhen China
Customer Support
Trade Show News
Blog Insights
Volume XL
MRSI-H3 High Speed Die Bonder Video
Trade Show News
Blog Insights
Volume XXXIX
Manufacturing Automation Case Study-Flexible High-Speed Die Bonding Automation Platform
Trade Show News
Blog Insights
Volume XXXVIII
MRSI Systems – “One Stop Shop” Product Demo at CIOE
Laser Focus World: Challenges for photonics manufacturing in the new data center era
Trade Show News
Volume XXXVII
MRSI Systems is Acquired by Mycronic AB
Volume XXXVI
Challenges in Die Bonding of Gallium Nitride High Power Devices
Customer Support and Training Programs
Scale with Us
Trade Show News
Blog Insights
Volume XXXV
Building Complex Hybrid Circuits-Advanced Packaging
Trade Show News
Blog Insights
Volume XXXIV
MRSI Systems Launches New Software Video Training Programs
Trade Show News – Visit MRSI at OFC in San Diego March 11-15
MRSI-M3 Epoxy Stamping Video
Blog Highlights
Volume XXXIII
New Product Spotlight MRSI-HVM3
New Website Process Pages
Trade Show News – Visit MRSI at OFC in San Diego March 11-15
Webinar New Insights – Watch the MRSI Webinar: The Challenges in High Volume Manufacturing of
Photonic Devices for Data Center Applications
Volume XXXII
High-volume manufacturing (HVM) of chip-on-submount (CoS): challenges and solutions – Chinese Version
MRSI Systems’ Story
Visit MRSI in San Francisco – SPIE Photonics West
MRSI Blog – Weekly Insights into the Advanced Electronic Packaging Industry
2017
Volume XXXI
Best Holiday Wishes from MRSI Systems
Watch the MRSI-705, 5 Micron Die Bonder Video
MRSI Blog – Weekly Insights into the Advanced Electronic Packaging Industry
Volume XXX
MRSI Systems Receives Funding from State of Massachusetts for Advanced Manufacturing Initiative
High Volume Manufacturing of Photonic Devices: Assembly Starts with Design
MRSI Blog – Weekly Insights into the Advanced Electronic Packaging Industry
Volume XXIX
Visit MRSI Systems at Productronica in Munich, Germany
MRSI Blog – Weekly Insights into the Advanced Electronic Packaging Industry
Volume XXVIII
MRSI is Sponsoring IMAPS 2017 — Raleigh, IMAPS 50th Anniversary Symposium
Visit MRSI at Productronica
CIOE – Big Success with Introduction of MRSI-HVM3
Volume XXVII
Upcoming Events: ECOC, Sweden, September 18-20 and Electronics Packaging Symposium, NY, September 19-20
Volume XXVI
Read our Latest Article in Chip Scale Review: High-volume manufacturing (HVM) of chip-on-submount (CoS): challenges
and solutions
Upcoming Events: China International Optoelectronic Expo September 6-9 and ECOC September 18-20
Volume XXV
MRSI Systems is Exhibiting at Semicon West
Customer Visits
MRSI Blog – Weekly Insights into the Advanced Electronic Packaging Industry
Volume XXIV
MRSI Sponsors FIRST Robotics Team
Customer Visits
Volume XXIII
Case Study – MRSI Systems Automated Microwave Hybrid Manufacturing at TESAT-Spacecom (TESAT)
TESAT’s challenge was to develop an “Automated Microwave Factory” to manufacture complex highly integrated LTCC microwave modules within the frequency range 2 to 77GHz, 24 hours per day including a manless overnight ghost shift
Our Chinese Website Launch
Volume XXII
Our latest blog post: Challenges in Die Bonding of Gallium Nitride High Power Devices
Gallium Nitride (GaN) materials have long been regarded as great alternatives and enhancements to GaAs and silicon-based counterparts for applications demanding high power and high frequency performance
Upcoming Conferences
Volume XXI
Our latest blog post: High Volume Manufacturing of Photonic Components and Modules.
In this post we discuss: Increasing demand for data and bandwidth requires high volume manufacturing (HVM) of photonics devices.
2016
Volume XX
Best Holiday Wishes from MRSI Systems
We wish you a very Happy Holiday season and a peaceful and prosperous New Year.
High Volume Manufacturing (HVM) of Chip on Submount (CoS)
Volume XIX
This month we launched our new website to celebrate our product family, share some great new technical content, and introduce you to our team.
Volume XVIII
Advance Eutectic Packaging for Volume Manufacturing of Photonic, Microwave and RF Electronics
Eutectic bonding is an area of particular interest in photonics, microwave and RF electronics, due to the need for a clean, highly thermally efficient process and for long-term reliability.
Volume XVII
MRSI Systems Provides MRSI-M3 Die Bonding Assembly Work Cell to Fabrinet
MRSI Systems Provides MRSI-M3 Die Bonding Assembly Work Cell to Fabrinet in Silicon Valley for Fast Prototyping and New Product Introduction.
Volume XVI
Die Bonding with Integrated In Situ UV Curing
One challenge in building photonic devices such as Active Optical Cables (AOC) is to ensure extremely accurate post die bond positioning of lenses or other critical devices.
Volume XV
Automated Material Traceability
Material traceability information is important for automotive components, medical devices, government contracts, aerospace & defense electronics and advanced manufacturing systems.
2015
Volume XIV
We wish you a happy holiday season and a peaceful and prosperous New Year.
Volume XIII
Device Flipping Mechanisms & Eutectic Stages & TO Can Package
Certain devices, especially optical parts, require a 90 degree change in orientation after pick up.
Volume XII
Achieving Accurate Global and Local Alignments
Having a proven ultra-accurate machine platform that is mechanically and thermally stable, with no cantilevered parts, is a baseline to achieve accurate device placement.
Volume XI
Automatic In-line Eutectic Die Bonding
Applications, such as RF Power devices, require high speed solutions which include automated in-line material handling with integrated eutectic die attach capability.
Volume X
Handling Large Aspect Ratio, Thin, Delicate Die
Many applications including RF Power, Optical and MEMS require large, thin, high aspect ratio devices. Aspect ratios can exceed 45 to 1.
Volume IX
AOC Die Bonder Integrated with In Situ Light Measurement
One challenge in building photonic devices, such as Active Optical Cables (AOC), is to ensure proper light coupling as early in the manufacturing process as possible.
Volume VIII
MRSI Sponsors First Robotics Team
FIRST® is an international not-for-profit organization founded by inventor Dean Kamen to inspire young people’s interest and participation in science, technology, engineering, and math).
Volume VII
MRSI Expands Customer Support Organization
To meet the demand of our rapidly expanding business, MRSI has been building up our customer support organization that is managed by Peter Cronin.
2014
December 2014
Die Bonding of Silicon Photonic Devices
Silicon photonics is an evolving technology in which data is transferred via light. Photons can carry far more data in less time than electrons providing scalable solutions for expanding data communication needs worldwide.
October 2014
Precision Dispensing of Conductive Epoxy
MRSI Systems, a leading manufacturer of dispense and assembly equipment for semiconductor and photonic packaging, is now offering its industry leading MRSI-175Ag with a Rotary Style Positive Displacement Pump with a new higher resolution motor….
July 2014
MRSI Systems, a leading manufacturer of semiconductor and optical assembly systems, is now offering its well-established M3 work cell with 1 micron placement accuracy…
May 2014
MRSI Systems Announces 2.5D/3D Thermo Compression Bonder
MRSI Systems has been in development of an automated system and processes for thermo compression bonding that enables new methods of assembling semiconductor devices…
April 2014
Active Optical Cables (AOC) Assembly
Active Optical Cables (AOC) technology is a cabling methodology that accepts the same electrical input as traditional copper cables, but utilizes optical fiber between the connectors…
January 27th 2014
MRSI Systems Acquisition is Completed
Today, we announce some exciting news as we enter the next chapter of our successful thirty year long history. The acquisition from Newport Corporation of MRSI Systems, a company established by the existing management team, is completed as of January 24, 2014…
January 10th 2014
Our systems are considered the industry standard for eutectic bonding. This capability includes the addition of a eutectic reflow station with fast temperature ramping capability…
2013
November 2013
Newport to Sell All Shares of MRSI to a Team of Current Management
MRSI was founded in 1984 and has remained focused on providing our customers with the highest quality services and solutions. On January 23, 2002 MRSI announced an agreement to be acquired by Newport Corporation…
October 2013
Servo Drive of Needle Mechanism Synchronized with Pick Up Collet
Thin die handling has become a common need among customers building high performance packages. MRSI is known as a leader in the industry for handling thin die…
August 2013
Real Time Video Provides Process Monitoring for Dispense and Assembly:
Real time video is available to monitor the dispense and assembly process on the Newport MRSI family of Dispense and Die Bonders…
July 2013
The MRSI-705 Assembly Workcell continues to set new industry standards for ultra-precise, high-speed component assembly…
June 2013
The Importance of Proper Lighting
Lighting is an important component of any vision recognition system. When it comes to lighting it is not a case of “one size fits all”…
May 2013
MRSI Systems has been busy adding new dispense features to the MRSI-175Ag Precision Dispense System and the dispensing options on our family of die bonders…