Gå till innehåll
Die bonding
Sök
Kontakta oss
Meny
Die bonding
Stäng
Sök
About us
History
Service & support
Why do customer's choose MRSI?
Career
Partners
Testimonials
About us
Under the MRSI brand, we offer industry-leading die bonders, with superior flexibility, ultra-high-accuracy, and multiple process options. Our product’s' value is further illustrated by our 40+ years of experience in the industry in tandem with our 24/7 reliable field operations.
About us
History
Service & support
Why do customer's choose MRSI?
Career
Partners
Testimonials
Products
High Precision Flip-chip Die Bonders
Submicron Die Bonders
1 Micron Die Bonders
MRSI-LEAP High-Speed Die Bonders
1.5 Micron Die Bonders
3 Micron Die Bonders
5 Micron Die Bonders
High Precision Epoxy Dispensers - MRSI-175Ag
Active Aligners - MRSI-A-L
Prototyping and Training Services
Prototyping
MRSI Systems Training Services
Products
MRSI values our customers, and our top priority is meeting our customers needs down to the finest detail. We are proud that all of our products are industry-leading, with superior flexibility, ultra-high-accuracy, and multiple process options.
Products
High Precision Flip-chip Die Bonders
Submicron Die Bonders
1 Micron Die Bonders
MRSI-LEAP High-Speed Die Bonders
1.5 Micron Die Bonders
3 Micron Die Bonders
5 Micron Die Bonders
High Precision Epoxy Dispensers - MRSI-175Ag
Active Aligners - MRSI-A-L
Prototyping and Training Services
Prototyping
MRSI Systems Training Services
Applications
Photonics
AOC
High Power Laser Diodes
Optical Components & Transceivers
Silicon Photonics
TO-TOSA/ROSA
Microwave & RF
RF Power Amplifier & Microwave Device
Microelectronics
Sensors
LIDAR, AR/VR/MR
Wafer Level Packaging
Applications
Applications
Photonics
AOC
High Power Laser Diodes
Optical Components & Transceivers
Silicon Photonics
TO-TOSA/ROSA
Microwave & RF
RF Power Amplifier & Microwave Device
Microelectronics
Sensors
LIDAR, AR/VR/MR
Wafer Level Packaging
Processes
Die bonding
Eutectic die bonding
Epoxy die bonding
Processes
Processes
Die bonding
Eutectic die bonding
Epoxy die bonding
Gallery
Video gallery
Image gallery
Gallery
Gallery
Video gallery
Image gallery
News & events
Events
Webinars
Press releases
News
Cases
Technical articles archive
Newsletters archive
News & events
News & events
Events
Webinars
Press releases
News
Cases
Technical articles archive
Newsletters archive
Contact us
MRSI North America
MRSI Automation (Shenzhen) Co., Ltd.
Mycronic Sweden HQ
Contact us
Visit our contact page for contact details for our sales and support departments.
Contact us
MRSI North America
MRSI Automation (Shenzhen) Co., Ltd.
Mycronic Sweden HQ
Mycronic globalt
Logga in
Hem
News & events
Events
Infostone Optical Communication and Market Technology Conference (IFOC 2025)
Location: Shenzhen, China
8 september - 9 september
Shenzhen, China
Die bonding
China
Chinese
Back
2025-07-12 08:35:51
