Die bonding

About us
- History
About us

Under the MRSI brand, we offer industry-leading die bonders, with superior flexibility, ultra-high-accuracy, and multiple process options. Our product’s' value is further illustrated by our 35+ years of experience in the industry in tandem with our 24/7 reliable field operations.
About us
- History
Products
- High precision dispensing solutions
- Active alignment solutions
Products

MRSI values our customers, and our top priority is meeting our customers needs down to the finest detail. We are proud that all of our products are industry-leading, with superior flexibility, ultra-high-accuracy, and multiple process options.
Products
- High precision dispensing solutions
- Active alignment solutions
Service & support
Case
Career
News & events
News & events
News & events
Contact us
Contact us

Visit our contact page for contact details for our sales and support departments.
Contact us

18 mars - 21 mars

Fountain Hills, AZ, USA

United States of America

English

IMAPS DPC 2024

The 20th Annual Device Packaging Conference (DPC 2024) is an event organized by the International Microelectronics Assembly and Packaging Society (IMAPS). It is a premier event this spring for the microelectronics assembly advanced packaging, that will bring together distinguished industry engineers, researchers, and experts while showcasing the latest developments in photonics and microelectronics. Booth: #55

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