
MRSI-LEAP High-Speed Die Bonders
- Very high throughput
- High accuracy
- Supports multiple epoxy bonding processes including stamping, dispensing, UV curing, and flip chip assembly
Applications & Features
- Flip-chip bonding, UV epoxy dispensing, in-situ UV curing, wafer-level packaging, and other processes are available
- Ultra-high placement accuracy achieved via intelligent motion control and high resolution vision alignment
- Unmatched Throughput: Automated material handling and smart multi-tool switching system
- Supports multiple epoxy bonding processes including stamping, dispensing, UV curing, and flip-chip assembly
- Proprietary Multi-die Eutectic Bonding: Solves double reflow issues in multi-die heating processes for reliable bonding
- Broad application compatibility: Suitable for AI optical modules, silicon photonics, LiDAR systems, and optical sensing applications
Value to our Customers
- Industry-leading throughput and ultra-high accuracy in high-volume manufacturing, with a pick-and-place process capable of achieving over 1,000 units per hour (UPH)
- Easy to use icon-based interface running on a Windows™ platform for ease of programming, and low-cost machine maintenance
- Industry-leading local technical support teams and application expertise
- 40+ years of experience in the industry with reliable 24/7 field operation
Configuration Highlights
- Advanced machine vision and tool design
- Modular design and field upgradeable
- Supports two 8-inch wafers and two 6-inch wafers
- Built-in conveyor and magazine design for high efficiency and throughput
- Automated dispensing and UV cure options available
Images
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MRSI-LEAP High-Speed Die Bonder
Brochure

MRSI-LEAP
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MRSI-LEAP
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