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Press releases

20 9月 2021, 15:00

MRSI to present at Automotive LIDAR 2021
13 9月 2021, 15:00

MRSI Systems 宣布“DIE PLACEMENT HEAD WITH TURRET” (集成水平转塔之芯片贴装头)已获得中国专利授权
13 9月 2021, 15:00

MRSI Systems Announces Chinese Patent Issued Covering Die Placement Head with Turret
14 8月 2021, 21:42

MRSI中国新产品演示中心开业，将出席讯石研讨会，参加CIOE展会并提供现场演示
10 8月 2021, 21:42

MRSI opens a new Product Demo Center in China, will present at the Infostone Conference and attend CIOE with live demos
8 7月 2021, 16:59

MRSI,Mycronic中国深圳新的产品演示中心正式成立
8 7月 2021, 15:00

MRSI Mycronic Opens New Demo Center in Shenzhen, China
16 3月 2021, 14:00

MRSI to Offer Live Die Bonding Demos at Laser World of Photonics, March 17-19, 2021
9 2月 2021, 15:00

MRSI-S-HVM Submicron Die Bonder won the award for “Infostone 2020 The Most Competitive Optical Communications Product”
9 2月 2021, 15:00

MRSI-S-HVM亚微米贴片机荣获“讯石2020年度光通信最具竞争力产品”