Go to main content
贴片
Search
Contact us
Menu
贴片
Close
Search
关于我们
History
Service & support
Why do customer's choose MRSI?
Career
Partners
Testimonials
关于我们
Under the MRSI brand, we offer industry-leading die bonders, with superior flexibility, ultra-high-accuracy, and multiple process options. Our product’s' value is further illustrated by our 40+ years of experience in the industry in tandem with our 24/7 reliable field operations.
Visit page 关于我们
History
Service & support
Why do customer's choose MRSI?
Career
Partners
Testimonials
产品介绍
High precision flip-chip die bonders
Submicron Die Bonders
1 micron die bonders
MRSI-LEAP High-Speed Die Bonder
1.5 micron die bonders
3 Micron Die Bonders
5 micron die bonders
High Precision Epoxy Dispensers - MRSI-175Ag
Active Aligners
Prototyping and training services
Prototyping
MRSI Systems Training Services
产品介绍
MRSI values our customers, and our top priority is meeting our customers needs down to the finest detail. We are proud that all of our products are industry-leading, with superior flexibility, ultra-high-accuracy, and multiple process options.
Visit page 产品介绍
High precision flip-chip die bonders
Submicron Die Bonders
1 micron die bonders
MRSI-LEAP High-Speed Die Bonder
1.5 micron die bonders
3 Micron Die Bonders
5 micron die bonders
High Precision Epoxy Dispensers - MRSI-175Ag
Active Aligners
Prototyping and training services
Prototyping
MRSI Systems Training Services
应用服务
Photonics
AOC
High Power Laser Diodes
Optical Components & Transceivers
Silicon Photonics
TO-TOSA/ROSA
Microwave & RF
RF Power Amplifier & Microwave Device
Microelectronics
Sensors
LIDAR, AR/VR/MR
Wafer Level Packaging
应用服务
Visit page 应用服务
Photonics
AOC
High Power Laser Diodes
Optical Components & Transceivers
Silicon Photonics
TO-TOSA/ROSA
Microwave & RF
RF Power Amplifier & Microwave Device
Microelectronics
Sensors
LIDAR, AR/VR/MR
Wafer Level Packaging
工艺技术
Die bonding
Eutectic die bonding
Epoxy die bonding
工艺技术
Visit page 工艺技术
Die bonding
Eutectic die bonding
Epoxy die bonding
设备功能合集
视频合集
图像合集
设备功能合集
Visit page 设备功能合集
视频合集
图像合集
新闻中心
Events
Webinars
Press releases
News
Cases
Technical articles archive
Newsletters archive
新闻中心
Visit page 新闻中心
Events
Webinars
Press releases
News
Cases
Technical articles archive
Newsletters archive
联系我们
MRSI North America
MRSI Automation (Shenzhen) Co., Ltd.
Mycronic Sweden HQ
联系我们
Visit our contact page for contact details for our sales and support departments.
Visit page 联系我们
MRSI North America
MRSI Automation (Shenzhen) Co., Ltd.
Mycronic Sweden HQ
Mycronic Global
Log in
Home
新闻中心
Press releases
Press releases
10 12月 2020, 15:00
MRSI Systems and Palomar Technologies Reach Agreement in Intellectual Property Dispute
20 10月 2020, 15:00
MRSI推出升级版MRSI-705贴片机 助力大批量制造
30 9月 2020, 15:00
MRSI launches MRSI-705 high-volume configuration
8 9月 2020, 15:30
MRSI发布为硅光器件、协同封装和晶圆级封装提供亚微米级贴片解决方案
8 9月 2020, 15:00
09/08/2020 – MRSI launches submicron die bonding solution for silicon photonics, co-packaging, and wafer-level packaging
13 8月 2020, 15:00
MRSI to present at IFOC and attend CIOE in September in Shenzhen including live product demos
19 6月 2020, 18:00
MRSI Systems赢得长期诉讼, Palomar的 “Double Pick” 专利权被判无效
2 6月 2020, 18:00
MRSI Systems Wins Years-Long Litigation Against Palomar Technologies By Invalidating Palomar’s “Double Pick” Patent
10 12月 2019, 15:00
MRSI Files Patent Infringement Lawsuit Against Palomar Technologies
27 11月 2019, 16:00
MRSI HVM系列贴片机荣获Laser Focus World创新者奖
1
...
4
5
6
7
8
2026/4/2 14:23:50