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Manual flying probe for PCB test
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atg Luther & Maelzer GmbH (HQ)
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Mycronic is a global high-tech company that develops, manufactures and markets production equipment that meets the electronics industry’s high demands for precision, flexibility and efficiency.
Product areas
SMT-Bestückung
Produkte
Leiterplattenbestückung
Jet printing
MY700JP
MY700JX
MY700JD
Lötpastenprüfung
PI Pico - 3D SPI
PI Primo - 3D SPI
SMT-Bestückung
MY300DX
MY300SX
MY300LX
MY300HX
MY300EX
Automatische optische Prüfung
MYPro I50
MYPro I51
MYPro I81
MYPro I91
Bauteillagerung
MYTower 5
MYTower 6
MYTower 6+
MYTower 7+
MYTower 5x
MYTower 6x
Prozess-Software
MYPro Link
MYPro Connect
MYCenter Analysis
Dispensing und Coating
Dispensen mit Tabletops
MYT50
MYT10
Inline-Dispensing
MYD50
MYD10
MY700JD
Dispensing valves
Industrielle Dispensinggeräte
MYC60
Conformal Coating
MYC10
MYC50
Conformal coating valves
I70X
Dienstleistungen
MYCare service contracts
Financing
Lösungen
PCB assembly solutions
Case stories
Webinare und Veranstaltungen
Webinars
Live events
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News
About us
MYNews magazine
Photomask equipment
Products
Display mask writer
Semiconductor mask writer
Multi-purpose mask writer
Display mask metrology system
Semiconductor mask metrology system
About us
Solutions
Large area measurement
LCD displays
Smartphone displays
News
More virtual interactions, and the rise of a metaverse
Service & support
Career
Why work at Mycronic?
Meet your new colleagues
Who are we?
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Contact us
Mycronic Sweden HQ
Bare board testing
About us
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Products
Manual flying probe for PCB test
A5 Neo
A7 Pro
A7-16 Pro
A7XW Pro
A9
A9 plus
Automated flying probe for PCB test
A7a Pro
A9a
A9aL
A9a plus
Flying probe for substrate test
S2-8 / S2-8 plus
S2-16 / S2-16 plus
S3
S3-8
Fixture based test systems
LM1000
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Flying ahead in Michigan with Calumet
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atg Luther & Maelzer GmbH (HQ)
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Always one micrometer ahead
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Mycronic is a world-leading provider of flexible, high-precision production solutions for electronics manufacturing. We strive to keep our customers at the forefront of the industry by offering innovative, sustainable, high-quality production solutions with long product life cycles – solutions designed around the people who use them.
About us
Always one micrometer ahead
Key facts about Mycronic
Strategy
History
Purpose & vision
Expertise & innovation
Organization
Sustainability
Our sustainability commitment
Our sustainability impact
Our roadmap to 2030
Key area: Innovation for sustainability
Key area: Future engineers through diversity
Key area: Climate impact
Responsible business practices
Policies
Code of Conduct
Distributor Code of Conduct
Supplier Code of Conduct
Supplier Code of Conduct for Service Providers and non-critical Suppliers
Quality & environmental policy
Diversity, equity & inclusion policy
Health & safety policy
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Through focus on innovation and organic growth, together with an active acquisition strategy and healthy profit contributions from all divisions, Mycronic is well-placed to continue its growth journey.
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Read our latest news and press releases here. See our upcoming events and webinars.
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Think of the most high-tech electronics products you can imagine. Then think one step further. What technology creates the most advanced high-tech of today? Ours do.
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Why work at Mycronic?
Meet your new colleagues
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Mycronic Sweden HQ
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Visit our contact page for contact details for our sales and support departments.
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Mycronic Sweden HQ
Mycronic Benelux
Mycronic China
Mycronic France
Mycronic Germany
Mycronic atg Luther & Maelzer GmbH (HQ)
Mycronic Japan Fukuoka
Mycronic Japan
Mycronic Singapore
Mycronic South Korea
Mycronic UK
Mycronic USA
Axxon China
MRSI USA
Mycronic Saint-Egrève
Mycronic Vietnam
Mycronic Mexico
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News & events
Our events
Upcoming Events
Past Events
7. Mai
Boxborough, MA, USA
IMAPS New England 2024
International Microelectronics Assembly and Packaging Society (IMAPS) New England 50th Symposium & Expo.
Die bonding
United States of America
English
9. April - 11. April
Anaheim Convention Center, CA
IPC APEX EXPO 2024
Discover the next generation of productivity at IPC APEX EXPO
PCB Assembly
United States of America
English
9. April, 08:00 - 11. April, 18:00
at Anaheim Convention Center, California
IPC 2024
Bare board testing
United States of America
English
26. März - 28. März
San Diego, CA USA
OFC 2024
MRSI Booth #1800
Die bonding
United States of America
English
25. März - 28. März
Paris Nord Villepinte
Global industrie 2024
PCB Assembly
France
French
20. März - 22. März
Shanghai New International Expo Center
LASER World of PHOTONICS CHINA 2024
Asia’s largest trade fair for the photonics industry. MRSI Booth #W1.1230
Die bonding
China
Chinese
20. März - 22. März
Shanghai International Expo Centre (SNIEC)
Productronica China 2024
PCB Assembly
China
Chinese
18. März - 21. März
Fountain Hills, AZ, USA
IMAPS Device Packaging Conference
The 20th Annual Device Packaging Conference (DPC 2024) is an event organized by the International Microelectronics Assembly and Packaging Society (IMAPS). It is a premier event this spring for the microelectronics assembly advanced packaging, that will bring together distinguished industry engineers, researchers, and experts while showcasing the latest developments in photonics and microelectronics. Booth: #55
Die bonding
United States of America
English
6. März - 8. März
Marina Bay Sands Singapore
Asia Photonics Expo 2024
MRSI will exhibit at the Asia Photonics Expo 2024. Booth: EF-23
Die bonding
Singapore
English
6. Februar - 8. Februar
Farnborough International Exhibition, J100
Southern Manufacturing 2024
The MYPro MY300 set the benchmark for productivity in high-mix PCB assembly. Now its successor, the MYPro A40, is raising the bar even further with 48% faster placement speeds and an ability to mount six times larger components with the MX7 high-speed mounthead. All so you can master any product mix. And pump up production volumes to levels never seen before.
PCB Assembly
United Kingdom of Great Britain and Northern Ireland
English
6. Februar - 8. Februar
Santa Clara, CA USA
Chiplet Summit 2024
MRSI is sponsoring the Second Annual Chiplet Summit at the Santa Clara Convention Center. It is the only event totally dedicated to the skyrocketing chiplet market. Booth #215
Die bonding
United States of America
English
30. Januar - 1. Februar
San Francisco, CA USA
Photonics West 2024
Photonics West is the world’s premier event for lasers, biomedical optics, biophotonics, quantum, and optoelectronics. Booth: #5409
Die bonding
United States of America
English
24. Januar - 26. Januar
Tokyo Big Sight, Japan
Nepcon Japan 2024
今回はハイフレックス事業部からPCBアセンブリプロセスで最大の効率と品質を実現できる製品群をご紹介します。 最大の見どころは、新製品のマウンター MYPro A40 です。 実装速度を48%高速化し、最高速度 59,000 CPHで、幅広い部品をハンドリングできます。 MX7高速マウントヘッドでこれまでの6倍のサイズの大型部品を実装できるようになりました。
PCB Assembly
Japan
Japanese
7. Dezember
California
Silicon Valley Expo & Tech Forum
Mycronic is exhibiting at Silicon Valley Expo & Tech Forum
PCB Assembly
United States of America
14. November - 17. November
Messe München, Booth A3.249
Productronica 2023
Discover the next generation of productivity at Productronica 2023.
PCB Assembly
Germany
English
14. November, 00:00 - 17. November, 00:00
Location: Munich, Germany
Productronica 2023
Bare board testing
Germany
German
9. November
Salt Lake City, Utah
Utah Expo & Tech Forum
Mycronic is exhibiting at Utah Expo & Tech Forum
PCB Assembly
United States of America
25. Oktober, 00:00 - 27. Oktober, 00:00
Nangang Exhibition Hall, Taipei / Taiwan
TPCA Show 2023
Bare board testing
Taiwan, Province of China
English
11. Oktober - 13. Oktober
Shenzhen World Exhibition & Convention Center
Nepcon Asia
Mycronic is exhibiting at Asia's leading PCBA technology show, Nepcon Asia.
PCB Assembly
China
10. Oktober - 11. Oktober
Minneapolis Convention Center
SMTA International
PCB Assembly
United States of America
English
3. Oktober - 5. Oktober
San Diego, CA, USA
IMAPS San Diego 2023
The International Symposium on Microelectronics IMAPS is focused on microelectronics and packaging supply chain technologies. Booth: #621
Die bonding
United States of America
English
2. Oktober - 4. Oktober
Glasgow, Scotland
ECOC
The ECOC Exhibition is the key meeting place for everyone in the fibre optic communication technology industry. Booth: #703
Die bonding
United Kingdom of Great Britain and Northern Ireland
English
2. Oktober - 5. Oktober
Online Event
Automotive LIDAR 2023
Dr. Irving Wang, Director of Marketing, MRSI Systems, Mycronic Group, will present “High-Volume Assembly of Photonics Devices,” on Thursday, October 5th, 2023.
Die bonding
United States of America
English
27. September - 28. September
Anaheim Convention Center, CA
Anaheim Electronics & Manufacturing Show
PCB Assembly
United States of America
English
26. September - 28. September
Jaarbeurs, Utrecht
Electronics & Applications 2023
Mycronic is exhibiting at Electronics & Applications 2023
PCB Assembly
Netherlands
13. September
Marriott Melville Long Island, NY
Long Island Expo & Tech Forum
PCB Assembly
United States of America
English
13. September - 15. September
Bangalore International Exhibition Center, Bengaluru
Productronica India 2023
Mycronic is exhibiting at Productronica India 2023
PCB Assembly
India
7. September
Shenzhen, China
China International Optoelectronic Expo Conference
Location: Shenzhen, China Dr. Limin Zhou will present “The Evolution and Trends of Optoelectronic Chip Packaging in the AI Era” during the Optoelectronic Chip Design, Manufacturing and Packaging Technology Forum.
Die bonding
China
English
6. September - 8. September
Shenzhen, China
CIOE – China International Optoelectronic Expo
CIOE is the world’s largest optoelectronics event. Location: Shenzhen World Convention & Exhibition Center Shenzhen, China. Booth: #10B79
Die bonding
China
English
4. September
Shenzhen, China
Infostone Optical Communication Market and Technology Conference (IFOC) 2023
Location: Shenzhen, China. Dr. Limin Zhou to present “Automotive Lidar Package & Assembly Technology Evolution Trend“
Die bonding
China
English
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11.05.2024 14:18:27