News

MRSI Shenzhen Demo Center grand opening ceremony

On August 8, 2021, MRSI Systems(Mycronic Group) held the grand opening of its Product Demonstration Center in Shenzhen, China.

Silver Epoxy Turns Black After an Oxygen Plasma Clean Prior to Wire Bonding – But so What?

Learn more about epoxy bleed from industry expert Tom Green. Here is the abstract of the white paper Silver Epoxy Turns Black After an Oxygen Plasma Clean Prior to Wire Bonding:

Irving Wang joins MRSI – Product Marketing

Irving Wang joined MRSI this year as the Director of Product Marketing. He is based in the US to spearhead MRSI’s push into the sub-micron market and to support our newly launched MRSI-S-HVM sub-micron product. Irving will be working closely with senior management and our customer base to develop our short and medium term product road map and go-to-market strategy.

Mycronic technology essential in 5G development

5G is expected to fundamentally alter the way we connect and communicate, because it has the capacity to connect everyone with everything - including devices, objects and machines. A key element in realizing the full potential of 5G is the shift to a new, decentralized infrastructure that ensures ultra-low latency in the communication between all these devices, objects and machines. In this article, let us explain why this is so important and how Mycronic technology is an essential component to the global roll-out of 5G.

MRSI-705 innovative high-volume configuration for lower cost manufacturing

5G infrastructure will require ultra-high bandwidth, latency up to 1 ms, and highly reliable connectivity. In addition, RF architectures need to be scalable, efficient, and extremely compact. This requires densification not only at the macro level with the installation of more base stations but also high-power density at the device level.

Die bonding solution targets modern photonics manufacturing – building bricks for 5G rollout

5G continues to drive the needs of the Datacom supply chain which presents challenges to photonic device manufacturers. In this article featured in Laser Focus World, MRSI highlights the high-volume, high-mix nature of optical components required for 5G wireless and 400G+ datacenter and backbone network applications, requiring flexible <±1.5 µm high accuracy die-bonder platforms. Our solution to these challenges includes our MRSI-HVM where our field application results demonstrate less than ±3 µm post-bonding accuracy.

MRSI Systems – CIOE 2020 & IFOC 2020 Highlights

CIOE was held from September 9-11, 2020, in a new location at the Shenzhen World Exhibition & Convention Center. There were 160,000sqm of Exhibition Area in 6 Halls, 2,500+ Exhibitors, and 89,294 professional visitors at the 3-day show, up 13% from 2019. CIOE’s exhibits impressed the attendees with numerous live demos of 400G and 800G optics, as well as innovations in the photonics ecosystem.

IMAPS 2020 Virtual Exhibition

MRSI is exhibiting at the 53rd International Symposium on Microelectronics from October 6-8th, 2020. Visit the MRSI Virtual Booth to chat with our team of technical experts to review our exciting new product launches and enhancements to our existing portfolio.

Interview with MRSI: Accuracy is improved to 1.5 microns to meet the 5G and 400G high-speed interconnection era of optical device automated placement solution system

During the summer, China Fiber Optics Online (CFOL), interviewed Dr. Limin Zhou, Senior Strategic Marketing Director of MRSI Mycronic to discuss MRSI’s latest product development and some of the key trends in the industry. Below we have captured some of the takeaways from the discussion.

MRSI will exhibit and present at the Automotive LIDAR 2020 Virtual Conference and Exhibition

MRSI to present at IFOC and Exhibit at CIOE in September in Shenzhen including live product demos

MRSI Systems will present at the 19th Infostone Optical Communications Conference(IFOC), organized by Infostone Communication Consultant. The event will take place in Shenzhen, China from September 7-8, 2020. Dr. Limin Zhou, Senior Director of Strategic Marketing, MRSI Systems, will be presenting “Innovative Assembly Solutions: Volume Manufacturing of Novel Devices in the 5G Era.”

MRSI’s August 2020 Laser Focus World Featured Article: Assembly solution addresses TO-can photonic device manufacturing challenges

In this week’s blog post we highlight our recent Laser Focus World published article on the challenges of new TO-can photonic device manufacturing.

MRSI solves one of the greatest challenges in modern photonics manufacturing

MRSI’s latest article in the July 2020 issue of Laser Focus World highlights a flexible die bonding solution for modern photonics manufacturing.

Join MRSI at the International Microwave Symposium

The world’s largest Microwave and RF industry event is being held virtually this year. 

SEMICON West 2020 Virtual Event

MRSI Systems invites you to SEMICON West 2020 Virtual Event from July 20-23, 2020.

MRSI’s heated head die bonder targets High-Density Photonic Devices

The Global deployment of 5G and the exponential growth of data centers is driving the demand for high-performance optical devices. These new high-performance optical devices generate many new requirements including much smaller packaging design, and smaller chips/dies with higher density in the package. These new high-performance photonic device requirements are not limited to 5G and Data Center applications. The new requirements are also needed in LiDAR, AR/VR, advanced photonic sensors, as well as in highly integrated silicon photonics devices.

Die bonding solution for Chip-on-Submount (CoS) – Excerpt from our LFW article

This excerpt from MRSI’s recent article emphasizes the CoS die bonding process requirements including geometric placement accuracy and void free eutectic bonding.

Advanced Photonics Applications – MRSI-H-LD

Designed for high-volume manufacturing of advanced photonics and RF / Microwave devices the MRSI-H-LD 1.5 micron die bonder delivers industry-leading speed without sacrificing ultra-high precision and superior flexibility. The system is capable of building of Chip-on-Carrier (CoC), Chip-on-Submount (CoS), Chip-on-Baseplate (CoB), passive lens attachment, and box packaging for customer’s products such as high–power laser diodes (HPLDs), Optical communication components, and RF power amplifiers, Microwave devices, as well as photonics sensors and silicon photonics components.

LASER World of PHOTONICS CHINA 2020

MRSI will exhibit at LASER World of PHOTONICS CHINA 2020 from July 3-5, 2020 in Hall 8, Booth #8.1E416 of the National Exhibition and Convention Center (NECC), in Shanghai, China. There will be over 1,000 exhibitors representing the leading companies active in laser, optics, and photonics industries. The exhibition encompasses the world’s top laser and photonics technologies, as well as state-of-the-art products.

High-power Laser Diode Manufacturing Challenges

This excerpt from MRSI Systems featured article in Laser Focus World highlights the HPLD industry manufacturing challenges and a die bonding solution to address these challenges.

Laser Focus World Featured Article – Die-bonder innovations target HPLD manufacturing challenges

MRSI’s latest article in Laser Focus World’s February Issue “Die-bonder innovations target HPLD manufacturing challenges” discusses the die bonding challenges of High-power laser diodes (HPLDs) packaging manufacturing and presents an innovative flexible solution for both chip and bar on submount without changeover.

MRSI is Exhibiting at the Optical Fiber Conference in San Diego

The Optical Fiber Conference (OFC) will be held at the San Diego Conference Center in San Diego, CA, USA from March 8-12, 2020.

MRSI Named in the 2019 Infostone Top Honors List in China, with the MRSI-HVM Series Receiving the Award for the Most Competitive Product for Optical Communications

MRSI Systems (Mycronic Group), a leading manufacturer of fully automated, high-precision, high-speed die bonding and dispensing systems, has been recognized in the list of 2019 Infostone top honors, and the MRSI-HVM series was awarded as one of the most competitive products for optical communications in 2019. On January 4, ICCSZ held its annual summary meeting in Pizhou, Jiangsu Province where MRSI’s Senior Director of Strategic Marketing, Dr. Limin Zhou, accepted the award on behalf of MRSI. More than 150 companies and 300+ people from the optical communications industry supply chain attended the event.

MRSI Systems’ Dr. Yi Qian: The Latest Solution for Automated Manufacturing of Optoelectronic Devices in the 5G Era

Meet with MRSI Systems at Photonics West in San Francisco

MRSI Systems to Exhibit MRSI-H-LD at Productronica

MRSI Systems is a leading manufacturer of fully automated, high-precision, high-speed die bonding, and epoxy dispensing systems, and will be exhibiting at Productronica from November 12-15, 2019 with Mycronic – Hall A3 Booth #341. Productronica is the world’s leading international trade fair for the development and production of electronics and will be held at Messe München in Munich, Germany. Request a meeting with MRSI at Productronica.

IMAPS Boston 2019 – Highlights

MRSI Systems钱毅博士：数据中心/5G时代光电子器件装配自动化制造的最新解决方案

MRSI to Sponsor and Exhibit at the 2019 International Symposium on Microelectronics in Boston

MRSI Systems is exhibiting at the 52nd International Symposium on Microelectronics from September 30-October 2, 2019 in Boston, MA at the Hynes Convention Center. Schedule a meeting with MRSI Systems at IMAPS Boston to learn more about how we can help meet your assembly needs. MRSI has been serving their optoelectronic and microelectronic customers for the past thirty-five years and understands the requirements to scale efficiently in today’s fast-paced marketplace.

Automotive LIDAR Conference and Exhibition 2019