News

MRSI is Presenting at ICCSZ OC Market and Technology Seminar and Offering Die Bonder Demonstrations at CIOE

Dr. Yi Qian, MRSI Systems: Automated Die Bonding Trends in the 5G Era

Thank You for Visiting MRSI at the International Microwave Symposium in Boston

Flexible Automation Solutions to Accelerate LiDAR Automotive Applications

Visit MRSI Systems Demonstration Center in Shenzhen – Mycronic Facility

MRSI Systems, a leading manufacturer of fully automatic, high-speed, high-precision, flexible and multi-functional die bonding systems, demonstration capability was officially opened at the Mycronic Demonstration Center in the Luchuang Yungu Building, Nanshan District, Shenzhen, China. ICCSZ News visited the demonstration center and learned about the current status of MRSI Systems and the application of MRSI-HVM3 placement equipment on May 15th.

Join MRSI Systems at SEMICON West 2019

MRSI Systems is exhibiting at SEMICON West (Booth #6163) from July 9-11th in San Francisco, CA at the Moscone Center.

Challenges and Solutions for Bonding Ultra-Small Ceramic End-Terminated Capacitors

Electronic components and packages continue the trend of miniaturization which drives demand for cost-effective assembly solutions for smaller components and packages. This is happening in end markets in Telecom/Datacom, Aerospace & Defense, Medical Devices, Computers and Peripherals, and Industrial.

MRSI Systems配备HVM3芯片贴装演示中心在深圳南山开放 欢迎参观

ICCSZ讯 近日，全自动，高速，高精度，灵活多功能的贴片系统的领先制造商MRSI Systems在中国深圳南山绿创云谷大厦的Mycronic展示中心正式开放。在MRSI Systems战略营销高级总监周利民博士的带领下，讯石人员参观了演示中心全貌并了解MRSI Systems的现状及MRSI-HVM3贴片设备的应用。

International Microwave Symposium 2019

MRSI Systems is exhibiting at IMS (Booth #686). The world’s largest Microwave and RF industry event is being held in Boston, MA this year at the Boston Convention Center from June 2-7, 2019.

MRSI Systems World Class Customer Support – Jack Inocencio

Jack was recently promoted to Customer Service Manager, reflecting a long and successful career with MRSI solving customer challenges. In his 10 year career with the company, Jack has accumulated an impressive set of skills covering process and application engineering as well as an intimate knowledge of our systems. Prior to MRSI his early career at Amkor Technology in the Philippines included roles to qualify products and optimize processes of advanced semiconductor packages. Jack holds a Bachelor’s Degree in Electronics and Communications Engineering.

Optoelectronics Packaging

MRSI Systems has been a leading supplier to manufacturers of advanced optical packaging assembly for over 30 years. This has enabled MRSI to build unmatched expertise in the assembly technologies required to successfully produce photonic integrated circuits. In recent years, the advantage of transferring data with photons instead of electrons, has become a widely accepted methodology for solving the packaging challenges resulting from our growing demand for data and bandwidth. The following post highlights optoelectronics packaging applications.

Visit MRSI Systems at SEMICON China 2019 in Shanghai

MRSI Systems is exhibiting at SEMICON China in Shanghai, March 20-22, 2019, at the Shanghai New International Expo Centre.

Dr. Limin Zhou Joins MRSI Systems – Strategic Marketing

Dr. Zhou joined MRSI Systems in 2019 as the Senior Director of Strategic Marketing. He is located in China to help develop new projects, customers, applications and markets. He also helps strengthen the relationship with current key accounts, given his extensive photonics network in that region, and helps develop the company’s market strategy and product roadmaps, drive the development of new products, and diversify MRSI’s product offerings to target higher growth market segments.

Great Week at SPIE Photonics West 2019

Thank you to all of our existing customers and new customers who visited us at SPIE Photonics West. The turnout at the booth was filled with great discussions. The event was well attended with over 20,000 people including over 1,300 companies.

Visit MRSI Systems at the Optical Fiber Conference in San Diego

Visit MRSI Systems at the Optical Fiber Conference in San Diego

MRSI Systems – “One Stop Shop” Fully Automated Die Bonding Solutions

Our die bonders are historically regarded the leaders in flexibility, and during the last two years, we have expanded our die bonding families. These high speed die bonders deliver industry-leading speed without sacrificing flexibility, precision or reliability. These die bonders provide superior flexibility for true multi-die, multi-process, multi-product high volume high mix production.  MRSI’s “One Stop Shop” die bonding solutions help our customers to enable just-in-time supply and fast-pace innovations of critical photonic components for high growth market segments, such as hyper-scale data centers, photonic sensors, and 5G wireless.

MRSI Systems is Exhibiting and Sponsoring SPIE Photonics West 2019

MRSI Systems will be exhibiting at SPIE Photonics West, held at the Moscone Center in San Francisco, CA, USA from February 5-7, 2019.

MRSI Systems Participates in Local Photonics & Advanced Manufacturing Symposiums

Automotive LIDAR Conference 2018: AI & Autonomous Vehicles

LIDAR (LIght Detection and Ranging) is a ranging and positioning system that measures distance to a target by illuminating the target with pulsed laser light and measuring the reflected pulses with a sensor. Differences in laser return times and wavelengths can then be used to make a digital image of the target and determine the distance from the sensor and its speed if moving.

Highlights of the Microelectronics Symposium

The 51st International Symposium on Microelectronics was held at the Pasadena Convention Center in Pasadena, California this month. This symposium is the premier event for microelectronic packaging technologies. The event was well attended with 1,000 participants including over 900 attendees and more than 100 exhibitors from 20 countries.

Case Study – The Latest Die Bonding Solutions for Photonics Manufacturing

This case study explains how MRSI achieved high throughput for high volume high mix production with flexible high volume high precision using their latest die bonding systems.

Photonics Manufacturing for the Hyperscale Data Center Era

International Microelectronics Assembly and Packaging Society (IMAPS) Symposium 2018

MRSI Systems is exhibiting at the 51st International Symposium on Microelectronics from October 8-11, 2018, in Pasadena, California at the Pasadena Convention Center. There will be over 100 booths on the exhibition floor from October 9-10, 2018, with companies from all segments of the microelectronics industry including Aerospace, Automotive, Computing, Industrial, Military, and Telecom/Datacom.

Visit MRSI Systems at the European Conference on Optical Communications (ECOC) 2018 – Fully Automated Die Bonders

MRSI Systems is exhibiting at ECOC in Rome, Italy, September 24-26, 2018 at the Fiera Roma, The Exhibition & Congress Centre of Rome. ECOC is the largest optical communications event in Europe. In 2017, there were 327 companies and over 5,900 visitors from 81 countries.

Manufacturing Automation Case Study – Flexible High-Speed Die Bonding Automation Platform

The following excerpt from MRSI Systems latest article published in Laser Focus World Magazine demonstrates how the latest advanced automated die bonding systems are transforming the world of photonics manufacturing.

MRSI Systems Announces “One Stop Shop” Die Bonding Solutions & Participation at CIOE and ECOC

MRSI Systems will be demonstrating our “One Stop Shop” capabilities at the 20th China International Optoelectronic Exposition (CIOE) at the Shenzhen Convention and Exhibition Center with our partner CYCAD Century Science and Technology (Booth #1C66) in Shenzhen, September 5-8, 2018.

Featured Article Laser Focus World: Challenges for photonics manufacturing in the new data center era

MRSI’s latest article in Laser Focus World’s August Issue Challenges for photonics manufacturing in the new data center era, discusses the high volume and high mix nature of photonics manufacturing, which requires flexible, high speed, and high precision automation to enable just-in-time supply and fast pace innovations of critical components to hyper-scale data centers.

IMS 2019 Boston

Software Video Training Programs for Die Bonding and Epoxy Dispense Systems