
Die bonding solutions
MRSI Systems – part of Mycronic Group
MRSI Die Bonding, Epoxy Dispensing, and Active Alignment Solutions

High Precision Die Bonders
MRSI is the leading manufacturer of fully automated, high-speed, high-precision and flexible eutectic and epoxy die bonding systems for R&D, NPI, and high-volume manufacturing of photonic devices such as lasers, detectors, modulators, WDM/EML TO-Cans, Optical transceivers, LiDAR, VR/AR, sensors, silicon photonics, co-packaging optics, and optical imaging products.

Active Alignment Solutions
MRSI A-L is a modular–design machine, with integrated pick and place, dispense, vision, alignment functions, as well as intelligent software that offers users flexible processes. It is a powerful tool for optical components assembly, such as transceivers, silicon photonics, AWGs, LiDAR, integrated optics etc.

High Precision Epoxy Dispensers
The next generation MRSI-175Ag Epoxy Dispenser handles the most demanding dispensing applications such as advanced packaging, microwave modules, optical modules, hybrid circuits, multichip modules, and semiconductor packaging. With the ability to operate two heads in tandem, the MRSI-175Ag provides unparalleled process control and comprehensive dispensing capability.

Prototyping & Training Services
MRSI offers a comprehensive set of prototyping and training services. Led by experienced engineers, the programs are tailored to suit each customer’s needs, including concepts of robot orientation, teaching alignments, the die bonding process and production set up for high-precision applications.
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27 JAN. 2025PRESSMEDDELANDEDIE BONDING SOLUTIONS
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30 SEP. 2024PRESSMEDDELANDEDIE BONDING SOLUTIONS
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4 SEP. 2024PRESSMEDDELANDEDIE BONDING SOLUTIONS
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19 MARS 2024PRESSMEDDELANDEDIE BONDING SOLUTIONS
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12 MARS 2024PRESSMEDDELANDEDIE BONDING SOLUTIONS
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7 juli - 10 juliEventDIE BONDING SOLUTIONS
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4 september - 6 septemberEventDIE BONDING SOLUTIONS
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10 september - 12 septemberEventDIE BONDING SOLUTIONS
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29 september - 1 oktoberEventDIE BONDING SOLUTIONS
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30 september - 1 oktoberEventDIE BONDING SOLUTIONS
