Die bonding solutions
MRSI Systems – part of Mycronic Group
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30 SEP 2024PRESS RELEASE
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4 SEP 2024PRESS RELEASE
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19 MAR 2024PRESS RELEASE
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12 MAR 2024PRESS RELEASE
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5 SEP 2023PRESS RELEASE
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19 NOV 2024EventDIE BONDING SOLUTIONS
MRSI Die Bonding, Epoxy Dispensing, and Active Alignment Solutions
High Precision Flip-chip Die Bonders
Active alignment solutions
MRSI A-L is a modular–design machine, with integrated pick and place, dispense, vision, alignment functions, as well as intelligent software that offers users flexible processes. It is a powerful tool for optical components assembly, such as transceivers, silicon photonics, AWGs, LiDAR, integrated optics etc.
High Precision Epoxy Dispensers
The next generation MRSI-175Ag Epoxy Dispenser handles the most demanding dispensing applications such as advanced packaging, microwave modules, optical modules, hybrid circuits, multichip modules, and semiconductor packaging. With the ability to operate two heads in tandem, the MRSI-175Ag provides unparalleled process control and comprehensive dispensing capability. Die attach, underfill, encapsulation, and multi-pin stamping are all supported on this flexible dispensing platform.
Prototyping & Training Services
MRSI offers a comprehensive set of prototyping and training services. Led by experienced engineers, the programs are tailored to suit each customer’s needs, including concepts of robot orientation, teaching alignments, the die bonding process and production set up.