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Eutectic die bonding

Die bonding solutions

MRSI Systems – part of Mycronic Group

MRSI Die Bonding, Epoxy Dispensing, and Active Alignment Solutions

MRSI-H1 Family, 1 Micron Die bonders
MRSI-H1 Family

1 Micron

Our solutions help our customers to enable high throughput production, just-in-time supply, and fast-pace innovations of critical photonic components for high growth market segments such as hyper-scale data centers, 5G wireless, LiDAR, VR/AR. Product configurations address specific application needs such as high-power laser diodes and multi-die TO products such as WDM & EML-TOs, Optical transceivers, LiDAR, VR/AR, sensors, silicon photonics, co-packaging optics, 3-D hybrid packaging, and optical imaging products.
High speed solutions with our MRSI-HVM family & MRSI-H family
MRSI-HVM & MRSI-H family

High speed die bonding solutions

Our MRSI-HVM Family is the best-in-class die bonder, offering leading speed, zero-time tool change, and <1.5 micron accuracy. the superior performance is enabled by dual heads, dual stages, an integrated "on-the-fly" tool changer, ultrafast eutectic stages, and multiple levels of parallel processing optimizations. Our MRSI-H family provides proven superior flexibility for true multi-die, multi-process, multi-product high-volume high-mix production with <1.5 micron accuracy.

MRSI-705 5 Micron
MRSI-705

5 Micron

Our solutions remain the standard in the industry delivering 3 and 5 micron accuracy across a complete range of applications. These system delivers an unmatched combination of accuracy, automation, speed and reliability with in-situ assembly processes such as eutectic die bonding, UV epoxy die attach and flip chip assembly (all configurable options). Both systems have been delivering consistent results in the field over decades.
175Ag Epoxy Dispenser
MRSI-175Ag

Epoxy dispenser

The MRSI-175Ag Epoxy Dispenser handles the most demanding dispensing applications such as microwave modules, optical modules, hybrid circuits, multi-chip modules, and semiconductor packaging. With the ability to operate two heads in tandem, the MRSI-175Ag provides unparalleled process control and comprehensive dispensing capability. Die attach, underfill, encapsulation and multi-pin stamping are all supported on this flexible dispensing platform.
MRSI-A-L Machine Shot
MRSI-A-L active aligner

Active alignment solutions

MRSI A-L is a modular–design machine, with integrated pick and place, dispense, vision, alignment functions, as well as intelligent software that offers users flexible processes. It is a powerful tool for optical components assembly, such as transceivers, silicon photonics, AWGs, LiDAR, integrated optics etc.
Automated processes help clients grow, VPT Components and MRSI Systems jointly address manufacturing challenges.
Case

Automated processes help clients grow

VPT Components is one of the largest providers of JAN certified semiconductors along with a full-service facility for the independent, unbiased testing and custom assembly of electronic components. Do you want to know how VPT Components and MRSI Systems jointly address manufacturing challenges?