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Why do customer's choose MRSI?
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Under the MRSI brand, we offer industry-leading die bonders, with superior flexibility, ultra-high-accuracy, and multiple process options. Our product’s' value is further illustrated by our 40+ years of experience in the industry in tandem with our 24/7 reliable field operations.
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History
Why do customer's choose MRSI?
Partners
Testimonials
Products
High precision flip-chip die bonders
Submicron Die Bonders
1 Micron Die Bonders
1.5 Micron Die Bonders
3 Micron Die Bonders
5 Micron Die Bonders
High Precision Epoxy Dispensers - MRSI-175Ag
Active Aligners - MRSI-A-L
Prototyping and training services
Prototyping
MRSI Systems Training Services
Products
MRSI values our customers, and our top priority is meeting our customers needs down to the finest detail. We are proud that all of our products are industry-leading, with superior flexibility, ultra-high-accuracy, and multiple process options.
Visit page Products
High precision flip-chip die bonders
Submicron Die Bonders
1 Micron Die Bonders
1.5 Micron Die Bonders
3 Micron Die Bonders
5 Micron Die Bonders
High Precision Epoxy Dispensers - MRSI-175Ag
Active Aligners - MRSI-A-L
Prototyping and training services
Prototyping
MRSI Systems Training Services
Service & support
Cases
MRSI Systems Automated Microwave Hybrid Manufacturing at TESAT-Spacecom (TESAT)
VPT Components and MRSI Systems jointly address manufacturing challenges
Cases
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MRSI Systems Automated Microwave Hybrid Manufacturing at TESAT-Spacecom (TESAT)
VPT Components and MRSI Systems jointly address manufacturing challenges
Career
Applications
Photonics
AOC
High Power Laser Diodes
Optical Components & Transceivers
TO-TOSA/ROSA
Microwave & RF
RF Power Amplifier & Microwave Device
Microelectronics
Sensors
LIDAR, AR/VR/MR
Applications
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Photonics
AOC
High Power Laser Diodes
Optical Components & Transceivers
TO-TOSA/ROSA
Microwave & RF
RF Power Amplifier & Microwave Device
Microelectronics
Sensors
LIDAR, AR/VR/MR
Processes
Die bonding
Eutectic die bonding
Epoxy die bonding
Processes
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Die bonding
Eutectic die bonding
Epoxy die bonding
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News & events
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Newsletters archive
Contact us
MRSI North America
MRSI Automation (Shenzhen) Co., Ltd.
Mycronic Sweden HQ
Contact us
Visit our contact page for contact details for our sales and support departments.
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MRSI North America
MRSI Automation (Shenzhen) Co., Ltd.
Mycronic Sweden HQ
Mycronic Global
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News & events
Press releases
Press releases
30 SEP 2024, 19:00
MRSI Mycronic introduces next generation high precision epoxy dispenser for advanced packaging
4 SEP 2024, 15:00
MRSI Mycronic to Showcase Advanced Assembly Solutions for High Volume Photonics Manufacturing at CIOE 2024
19 MAR 2024, 20:00
新机发布|MRSI(Mycronic集团)发布创新MRSI-A-L耦合设备,引领精密光学组件封装新纪元
12 MAR 2024, 15:00
MRSI introduces innovative MRSI-A-L Active Aligner for optical packaging solutions
5 SEP 2023, 15:15
MRSI introduces 705HF High Force Die Bonder for power devices and advanced chip packaging
21 AUG 2023, 21:15
MRSI Mycronic to showcase and present innovative die bonder solutions at CIOE 2023
9 AUG 2023, 15:00
MRSI Systems wins Silver Honoree for Laser Focus World Innovators Award 2023
10 JUL 2023, 15:00
MRSI to exhibit with live demonstrations and present at LASER World of PHOTONICS CHINA
13 SEP 2022, 11:46
MRSI launches new die bonders with improved accuracy
22 AUG 2022, 19:00
MRSI receives Laser Focus World Silver Award for MRSI-H-HPLD Die Bonder
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