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Optical Components & Transceivers

Optical Components & Transceivers

For Optical Transceivers, the Chip-on-carrier/submount (CoC/CoS) bonding is done first. Then the CoC/CoS is bonded onto a common baseplate for lens/mirror attachment before putting it into a package. The latest trend is for more components such as the lasers, capacitors, and thermistors to be attached onto a common carrier by either eutectic or epoxy die bonding. For gold-box packaging such as transceivers with high-power lasers, typically chip-on-carrier/submount (CoC/CoS) bonding is done first and then the CoC/CoS is bonded onto a common baseplate for lens/mirror attachment before putting it into a package. More chips or die need to be attached onto a common carrier by either eutectic die bonding or epoxy die bonding.

Die Attach

  • Eutectic

  • Epoxy stamping

  • 0.5μm, 1.5μm, 3μm, 5μm

  • Chip-on-Carrier (CoC),  Chip-on-Submount (CoS)

Lens Attach

  • UV epoxy dispensing

  • In-situ UV curing

  • Placement accuracy options: 3μm, 5μm

  • Passive Optical Alignment

Gold-box Packaging

  • Thermal and UV Epoxy

  • Eutectic

  • Placement accuracy options: 3μm, 5μm