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About us
History
About us
Under the MRSI brand, we offer industry-leading die bonders, with superior flexibility, ultra-high-accuracy, and multiple process options. Our product’s' value is further illustrated by our 35+ years of experience in the industry in tandem with our 24/7 reliable field operations.
About us
History
MRSI Systems Products
Ultra high precision solutions
High speed solutions
High flexibility solutions
Active alignment solutions
High precision dispensing solutions
MRSI Systems Products
MRSI values our customers, and our top priority is meeting our customers needs down to the finest detail. We are proud that all of our products are industry-leading, with superior flexibility, ultra-high-accuracy, and multiple process options.
MRSI Systems Products
Ultra high precision solutions
High speed solutions
High flexibility solutions
Active alignment solutions
High precision dispensing solutions
Service & support
Case
Career
News & events
Press releases
News
Events
Photonics West 2024
Chiplet Summit 2024
OFC 2024
SEMICON West 2024
IMAPS New England 2024
Compound Semiconductor Conference
Webinars
News & events
News & events
Press releases
News
Events
Photonics West 2024
Chiplet Summit 2024
OFC 2024
SEMICON West 2024
IMAPS New England 2024
Compound Semiconductor Conference
Webinars
Contact us
MRSI North America
MRSI Automation (Shenzhen) Co., Ltd.
Mycronic Sweden HQ
Contact us
Visit our contact page for contact details for our sales and support departments.
Contact us
MRSI North America
MRSI Automation (Shenzhen) Co., Ltd.
Mycronic Sweden HQ
Mycronic globalt
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News & events
Events
Events
Upcoming Events
Past Events
7 maj
Boxborough, MA, USA
IMAPS New England 2024
International Microelectronics Assembly and Packaging Society (IMAPS) New England 50th Symposium & Expo.
Die bonding
United States of America
English
26 mars - 28 mars
San Diego, CA USA
OFC 2024
MRSI Booth #1800
Die bonding
United States of America
English
20 mars - 22 mars
Shanghai New International Expo Center
LASER World of PHOTONICS CHINA 2024
Asia’s largest trade fair for the photonics industry. MRSI Booth #W1.1230
Die bonding
China
Chinese
18 mars - 21 mars
Fountain Hills, AZ, USA
IMAPS Device Packaging Conference
The 20th Annual Device Packaging Conference (DPC 2024) is an event organized by the International Microelectronics Assembly and Packaging Society (IMAPS). It is a premier event this spring for the microelectronics assembly advanced packaging, that will bring together distinguished industry engineers, researchers, and experts while showcasing the latest developments in photonics and microelectronics. Booth: #55
Die bonding
United States of America
English
6 mars - 8 mars
Marina Bay Sands Singapore
Asia Photonics Expo 2024
MRSI will exhibit at the Asia Photonics Expo 2024. Booth: EF-23
Die bonding
Singapore
English
6 februari - 8 februari
Santa Clara, CA USA
Chiplet Summit 2024
MRSI is sponsoring the Second Annual Chiplet Summit at the Santa Clara Convention Center. It is the only event totally dedicated to the skyrocketing chiplet market. Booth #215
Die bonding
United States of America
English
30 januari - 1 februari
San Francisco, CA USA
Photonics West 2024
Photonics West is the world’s premier event for lasers, biomedical optics, biophotonics, quantum, and optoelectronics. Booth: #5409
Die bonding
United States of America
English
3 oktober - 5 oktober
San Diego, CA, USA
IMAPS San Diego 2023
The International Symposium on Microelectronics IMAPS is focused on microelectronics and packaging supply chain technologies. Booth: #621
Die bonding
United States of America
English
2 oktober - 4 oktober
Glasgow, Scotland
ECOC
The ECOC Exhibition is the key meeting place for everyone in the fibre optic communication technology industry. Booth: #703
Die bonding
United Kingdom of Great Britain and Northern Ireland
English
2 oktober - 5 oktober
Online Event
Automotive LIDAR 2023
Dr. Irving Wang, Director of Marketing, MRSI Systems, Mycronic Group, will present “High-Volume Assembly of Photonics Devices,” on Thursday, October 5th, 2023.
Die bonding
United States of America
English
7 september
Shenzhen, China
China International Optoelectronic Expo Conference
Location: Shenzhen, China Dr. Limin Zhou will present “The Evolution and Trends of Optoelectronic Chip Packaging in the AI Era” during the Optoelectronic Chip Design, Manufacturing and Packaging Technology Forum.
Die bonding
China
English
6 september - 8 september
Shenzhen, China
CIOE – China International Optoelectronic Expo
CIOE is the world’s largest optoelectronics event. Location: Shenzhen World Convention & Exhibition Center Shenzhen, China. Booth: #10B79
Die bonding
China
English
4 september
Shenzhen, China
Infostone Optical Communication Market and Technology Conference (IFOC) 2023
Location: Shenzhen, China. Dr. Limin Zhou to present “Automotive Lidar Package & Assembly Technology Evolution Trend“
Die bonding
China
English
11 juli - 13 juli
Shanghai, China
LASER World of PHOTONICS CHINA
Asia’s largest trade fair for the photonics industry. Shanghai New International Expo Center. MRSI Booth: 7.1B141
Die bonding
China
Chinese
11 juli - 13 juli
San Francisco, CA USA
SEMICON West
SEMICON West includes the extended microelectronics industry supply chain. Booth: South Hall #762
Die bonding
United States of America
English
13 juni - 15 juni
San Diego, CA
IMS - International Microwave Symposium
IMS is focused on the microwave industry. MRSI Booth: #2243
Die bonding
United States of America
English
5 juni - 7 juni
Suzhou, China
Auto Lidar Tech Conference
MRSI to exhibit and present. Booth: #B-068
Die bonding
China
English
2 maj
Boxborough, MA, USA
IMAPS New England
International Microelectronics Assembly and Packaging Society (IMAPS) New England 49th Symposium & Expo.
Die bonding
United States of America
English
2024-05-09 10:17:12