News

Join MRSI Systems at IMAPS Device Packaging Conference this spring!

The most comprehensive event this spring for microelectronics assembly advanced packaging returns to Fountain Hills, Arizona.

MRSI-H-HPLD 1.5 micron Die Bonder Won the Award for “Infostone 2022 Outstanding Technology”

On December 29, 2022, Infostone 2022 Annual meeting and the 9th Heroes List award live conference was successfully held. During the conference, Infostone announced the 9th heroes company list in four categories: “The Most Competitive Products of Optical Communication”, “Excellent Quality Award”, “Outstanding Technology Award” and “Recommended Brand Award”, which aim to identify the outstanding products. MRSI Systems’ MRSI-H-HPLD 1.5-micron die bonder has been awarded the “Infostone 2022 Outstanding Technology Award”, showing the unanimous recognition of this product by the panel of industry experts.

Experience MRSI’s latest innovations at the OFC Exhibition

MRSI will be a featured exhibitor at the OFC Exhibition. The OFC Exhibition is a unique and premium opportunity to immerse yourself into the photonics industry.  

Improve pick and place machine utilization by keeping dies in their places

Join MRSI at SPIE Photonics West in San Francisco

Meet with MRSI Systems, Mycronic Group in San Francisco Booth #5405

The Japanese version of MRSI’s article “Die-bonder innovations target HPLD manufacturing challenges” is now available

MRSI’s article in Laser Focus World’s February 2020 Issue “Die-bonder innovations target HPLD manufacturing challenges” discusses the die bonding challenges of High-power laser diodes (HPLDs) packaging manufacturing and presents an innovative flexible solution for both chip and bar on submount without changeover.

MRSI to present and attend 4th LiDAR Tech 2022

MRSI will attend the 4th LiDAR Tech Forum taking place from November 16-18, 2022 in Suzhou, China. This event will focus on market trends, technological breakthroughs, and practical applications of LIDAR technology.

MRSI presented “Assembly Challenges and Solutions for Photonics Devices in Automotive LIDAR” at Automotive LIDAR 2022

MRSI will be attending and sponsoring IMAPS Boston 2022

MRSI Systems, Mycronic Group will be exhibiting at the 55th International Symposium on Microelectronics from October 4-5th in Boston Massachusetts at the Hynes Convention Center.

MRSI to exhibit at the European Microwave Week in Milan

MRSI Mycronic to Present at Automotive LIDAR 2022

Join us at the 5th annual Automotive LIDAR conference and exhibition from September 20-22nd. Automotive LIDAR is the only conference to be primarily focused on automotive LIDAR technologies and applications. The sessions provided will explain the approaches that create a LIDAR system.

Visit MRSI at ECOC in Basel, Switzerland

MRSI to present at the 21st Infostone Optical Communication Market and Technology Conference

MRSI will be presenting at the Infostone Optical Communication Market and Technology Conference which will be held at the Hyatt Regency Shenzhen Airport Hotel in Shenzhen, China from September 5-6, 2022. (Postponed to September 2023)

MRSI to exhibit with live demonstrations and present at the China International Optoelectronic Conference (CIOE) in Shenzhen

We are proud to announce that MRSI will be exhibiting at this year’s 24th China International Optoelectronic Exposition. This event will be held from September 7-9th (Postponed to September 6-8, 2023) at the Shenzhen World Exhibition and Convention center. Visit MRSI at booth #10B79.

MRSI to present at LaserFocusCon 2022

We are pleased to announce that MRSI will be exhibiting at this year’s LaserFocusCon in Suzhou, China on August 30th.

MRSI Systems (Mycronic Group) delivered a keynote speech at the 2022 CFOL Optical Interconnection Conference and MRSI-H-HPLD+ 1.5 micron Die Bonder won the Award for “2022 CFOL Product Innovation”

Dr. Limin Zhou, Senior Director of Strategic Marketing at MRSI Systems (Mycronic Group) and General Manager of MRSI Automation (Shenzhen) Co., Ltd., was invited to participate in the 2022 CFOL Optical Interconnection Conference on behalf of MRSI and presented “High Reliability Assembly Technologies & Applications of Photonics Chips/Dies.”

ECTC San Diego 2022 Highlights

Visit MRSI at the Compound Semiconductor Advanced Technology & Application Conference

Visit us at the CSC Conference in Suzhou, China from August 3-4th to discuss the current and future states of compound semiconductor device technology with us and other industry experts.

Join MRSI at SEMICON West 2022

Come visit us at the International Microwave Symposium

Join us in our booth at the Denver, Colorado IMS event this month to talk with us and build connections! We will be more than happy to discuss the current products our company has to offer.

Visit MRSI at ECTC in San Diego

MRSI Systems is exhibiting at the IEEE 72nd Electronics Components and Technology Conference from June 1-3, 2022 in San Diego, CA. Stop by the MRSI Booth #613 to learn how we can help solve your manufacturing challenges.

MRSI is presenting and sponsoring the iMAPS New England 48th Symposium and Expo

The iMAPS New England Symposium and Expo will be held in Boxborough, MA on May 3rd, 2022 at the Boxboro Regency Hotel.

Learn more about how MRSI solves RF PA device manufacturing challenges

MRSI’s fully automated die bonding solutions help RF power amplifier device manufacturers to address manufacturing requirements and challenges.

MRSI to exhibit at LASER World of PHOTONICS Munich

MRSI will be exhibiting at LASER World of PHOTONICS, held at Messe München from April 26-29th, 2022. This is the 25th year of LASER World of PHOTONICS the world’s leading trade fair for components, systems and applications of photonics.

Invitation to MRSI Webinar: MRSI is presenting at the 2022 ATC Webinar on Vehicle LIDAR Manufacturing

Abstract: on March 17th, 2022, Dr. Limin Zhou, Senior Director of Strategic Marketing at MRSI Systems (Mycronic group) and General Manager of MRSI Automation (Shenzhen) Co., Ltd., is invited to participate in the ATC webinar on behalf of MRSI. Limin will present “Solutions for Mass Production of Vehicle LiDAR.”

Visit MRSI at IMAPS Device Packaging in Arizona

MRSI is attending and sponsoring the 18th Annual IMAPS Device Packaging Conference and Exhibition.

MRSI is exhibiting at the Optical Fiber Conference

OFC will be held at the San Diego Conference Center from March 6-10th, 2022 in San Diego, CA, USA. OFC is the largest global conference and exposition for optical communications.

The Versatile MRSI-HVM

2021 was a great year for our best-selling product, the MRSI-HVM 1.5 micron high-speed die bonder. This system meets the needs of many industries from telecom, datacom and medical devices manufacturers to most commercial sectors. We have built up a considerable case file on customers achieving attractive ROIs from the MRSI-HVM when building high-volume products.

MRSI Systems (Mycronic Group) 应邀出席2021（第三届）激光雷达前瞻技术展示交流会并发表“车载激光雷达光器件封装的挑战与解决方案”的演讲

摘要：（第三届）激光雷达前瞻技术展示交流会于2021年12月14日-12月15日在江苏苏州举办。MRSI Systems战略市场高级总监，周利民博士出席2021（第三届）激光雷达前瞻技术展示交流会并发表“车载激光雷达光器件封装的挑战与解决方案”的演讲。

MRSI-H-TO 1.5 micron Die Bonder Won the Award for “Infostone 2022 Outstanding Technology”

On January 11, 2022, the Infostone 2022 Annual meeting and the 8th Heroes List awards ceremony were held.