The future of SMT production is increasingly complex. Denser boards, a wider range of miniaturized components, more NPIs and erratic production schedules. As these high-mix challenges go mainstream, real productivity and throughput suffer. And we’ve only just seen the beginning. At Mycronic, we’ve devoted decades of experience to solving precisely these challenges. With the industry’s fastest, most flexible and most precise jet printing and dispensing systems.
Three high-speed models. One state-of-the-art platform.
The MY700 high-speed jet dispensing platform for solder paste and a wide range of assembly fluids, incorporates three highly productive machine models, each one with its own set of unique capabilities.
MY700JD – Jet Dispenser
MY700JP – Jet Printer
MY700JX – Jet Printer and Dispenser
A highly advanced motion system makes it possible to dispense fluids on-the-fly at 300 dots per second and 3g acceleration with superior accuracy. Dot volume, size and shape are easy to adjust and optimize for each individual component and pad on the board. The MY700 is a software driven platform and requires no or little operator intervention resulting in a consistent and accurate result for each and every component on the board every time. The dual-lane option allows for efficient handling of boards in the line eliminating board transfer times to virtually zero.
The MY700 is equipped with a state-of-the art vision system providing fiducial recognition on-the-fly and accurate laser height measurement to automatically compensate for board stretch and warpage that will secure the quality of the dispensing result. All this in a compact package, accessible both front and rear with a footprint of no more than one-and-a-half square meters.
Double up on versatility, speed and precision
The MY700 Jet Printer and Jet Dispenser is unbelievably fast, precise and allows you to produce complex boards with a speed of more than one million dots per hour. The MY700 handles flexible substrates, LED boards, cavities and package-on-package applications without hassle. Its non-contact nozzle that jets with high precision makes every solder paste deposit perfect, reducing the need for re-working and increasing overall throughput. Dispensing glue or other assembly fluids with the same machine, in the same process step, saves space in the factory. Encapsulation, selective coating, dots and lines with epoxy, glue or other assembly fluids are impressively fast.
Smarter software for intelligent automation
The MY700 is a 100% software driven platform and allows you to prepare new jobs off-line in just minutes. Simply import CAD or Gerber data, optimize for any particularly challenging components, and cut your response time to your customer down to minutes instead of days. Simpler jobs can be prepared right at the machine for modifications on-the-fly. MY700 can easily be integrated into a fully automated production line, allowing for changes of product down to batch size one, with no human intervention. By logging each board’s bar code ID along with process data you’ll make sure you keep your production history safely stored and traceable.
Max board size
Min dot size
Max dot size
* The minimum and maximum dot size depends on selected ejector type and paste/adhesive
**Longer boards can be handled with external conveyors
With more than 40 years in the electronics industry and a unique market leading position you can count on us. We understand the fast changes in the market and have a strong local presence in over 50 countries to help our customers. We deliver technologies that are future proof and are devoted to our mission and our clients.