PCB ASSEMBLY
Solder paste perfection at jet speed
Since its introduction over a decade ago, solder paste jet printing has continued to improve the quality and versatility of electronics manufacturers worldwide. This is especially true in the world of high-mix electronics, where the high accuracy and high flexibility of software-driven assembly processes are crucial to competitiveness. Now, with faster jetting speeds, a wider range of compatible solder pastes and tightly integrated solder paste inspection (SPI) capabilities, jet printing has matured into a powerful platform for increased production efficiency and improved first-pass yield.