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Case Study – Leading Photonic Component Manufacturer Selects MRSI Systems to Produce Photonic Components Faster

Automated Die Bonding for High Volume Optoelectronics Packaging

销售完成后，后续支持是检验优质业务的一项标准。如果我遇到问题怎么办？您可以找到一个受过系统内培训并能迅速处理问题的人员吗？接到您的电话或电邮后，客户支持流程将立即启动。一名 MRSI Systems 员工将与您对话，了解您的需求和想要完成的任务。了解您的目标后，我们会根据此目标创建一个明确的行动路线并进行沟通。从听取客户意见到快速及时的交付，这个流程会不断重复，直到您的所有需求都得以满足、您感到满意为止。

MRSI Systems Customer Support Team – Ezer Espares

4 Recent Topics in Advanced Packaging

Innovation and new market factors are driving advanced packaging. In this post, we highlight some of the trending topics propelling advanced packaging and ask why now, what problem is the new technology solving, and finally what are the implications.

International Microwave Symposium 2017

ECTC – The 67th Electronic Components and Technology Conference

MRSI Systems is exhibiting at the 67th ECTC focused on the global microelectronics packaging industry.

MRSI Systems Participated in MIT Microphotonics Center / AIM Photonics Spring Technical Meeting in Cambridge

In March 2017, MRSI Systems participated in The MIT Microphotonics Center and AIM Photonics Spring Meeting for Integrated Photonics Manufacturing Meeting.

2017 Optical Fiber Communication Conference and Exhibition (OFC) Highlights

iMAPS New England 44th Symposium and Expo: “The Jetsons 2017”

Hybrid Electronics Technology for Printed Lighting

Several members of the MRSI Systems’ team attended the February iMAPS New England-SMTA Boston Technical presentation by Dr. Adam Scotch—“Challenges of Integrating Printed Electronics into the Lighting Industry.” MRSI Systems has been a long-time supporter of iMAPS. Jon Medernach, Key Account Manager, is the current President of iMAPS New England and has been active with iMAPS New England holding previous positions of Vice President and Technical Chair.

What is the Future of Optoelectronics Packaging?

Innovation in wireless technology leads to faster and smarter networks. 5G and the Internet of Things (IoT) have the capacity to connect everyone and all machines. In this post, we will explain how 5G implementation will enable new advances and challenges in the optoelectronics packaging industry.

Technology Students Experience Local Advanced Technology Manufacturer Up Close

Join MRSI Systems at OFC!

MRSI is exhibiting at the Optical Fiber Communication Conference and Exhibition (OFC) March 21-23, at the Los Angeles Convention Center (Booth 1728). We invite you to explore MRSI’s product offerings of epoxy and eutectic die bonders by visiting us at the show.

Challenges in Die Bonding of Gallium Nitride High Power Devices

The gallium nitride (GaN) device market is rising at a compound annual growth rate of (CAGR) of 17.1% according to Mordor Intelligence, implying a rise from $711m to $1.8 billion by 2023.

Multiple Die Eutectic Bonding

High Volume Manufacturing of Photonic Components and Modules

Increasing demand for data and bandwidth requires high volume manufacturing (HVM) of photonics devices. This expansion with double-digit growth rates is driven by increased data consumption. The data bandwidth demand from individual consumers and enterprises creates the need to upgrade long haul networks, data centers and metropolitan communication systems.

MRSI Systems Presented at Massachusetts Integrated Photonics Manufacturing Supply Chain Meeting held at MIT in Conjunction with 2016 AIM Photonics / MIT Microphotonics Center Fall Meeting

On November 2, 2016, MRSI Systems participated in the Commercial and Business Opportunities panel discussions at Massachusetts (MA) Integrated Photonics Manufacturing Supply Chain Meeting at MIT. The panel consisted of Analog Devices, MACOM and MRSI Systems, and local MA companies involved in the integrated photonics field. The meeting was part of a series of initiatives under the recently established American Institute of Manufacturing Photonics (AIM Photonics).

Advanced Vision Systems

Advanced Vision Systems — Increasing demand for data and bandwidth requires high-volume manufacturing of photonics and RF electronics at a level we have never seen before. In this post, we examine a specific feature required from these new levels of demand, Advanced Vision Systems.

Challenges in High-Volume Manufacturing for Die Attach Systems

Increasing demand for high-volume manufacturing accelerates the continuing adaptation of full automation in advanced eutectic packaging. From the perspective of potential purchasers of die attach systems, this demand level places both general requirements on them and also very specific requirements from the systems they purchase. The general requirements include the need for lower cost manufacturing (which is difficult given increasing labor costs in popular manufacturing bases, such as in China) and the need for a much higher level of automation in the industry.