Flexible dispensing platform
High precision dispensing solutions
MRSI Systems' family of fully automated, high-speed, high-precision and flexible eutectic and epoxy die bonding systems offers a complete suite of products across the volume spectrum.
The MRSI-175Ag Epoxy Dispenser handles the most demanding dispensing applications such as microwave modules, optical modules, hybrid circuits, multi-chip modules, and semiconductor packaging. With the ability to operate two heads in tandem, the MRSI-175Ag provides unparalleled process control and comprehensive dispensing capability. Die attach, underfill, encapsulation and multi-pin stamping are all supported on this flexible dispensing platform.
For further details download the product brochure on MRSI's website:
Learn more about MRSI
MRSI Systems, part of Mycronic Group, is the leading manufacturer of fully automated, high-speed, high-precision and flexible eutectic and epoxy die bonding systems. We offer solutions for research and development, low-to-medium volume production, and high-volume manufacturing of photonic devices such as lasers, detectors, modulators, AOCs, WDM/EML TO-Cans, Optical transceivers, LiDAR, VR/AR, sensors, silicon photonics, co-packaging optics, 3-D hybrid packaging, and optical imaging products.