MRSI Mycronic to Showcase Advanced Assembly Solutions for High Volume Photonics Manufacturing at CIOE 2024

MRSI Mycronic, a part of the Mycronic Group, will be exhibiting and presenting innovative advanced assembly solutions at the 24th China International Optoelectronic Exposition (CIOE) from September 11-13, 2024, at the Shenzhen World Exhibition and Convention Center. As an industry leader for over 40 years, MRSI Mycronic will showcase our family of die bonders and active aligners designed for precision, speed, and reliability that meet the evolving needs of key markets. For example, the rapid deployment of AI clusters demands higher speed optical interconnects that must be packaged using higher accuracy techniques for both single-mode and multi-mode transceivers in high volume manufacturing. MRSI’s new active aligners (MRSI-A-L) and 1-micron die bonders (MRSI-H1/HVM1) meet this challenge perfectly, for all the processes a customer might employ. Please visit our booth to learn about our latest products and applications. MRSI’s technical experts will be on site to discuss your application requirements in-depth.

The High-Performance and Flexible MRSI A-L for Optical Assembly

The optical components industry demands highly precise and customized equipment for complex optical assembly processes. We have answered this need with our new active aligner – a high-performance and flexible solution for manufacturing transceivers, AWGs, LiDAR, silicon photonics, integrated optics, and more.

MRSI shines at May events: showcased and featured

In the bustling world of technology, May was a month marked by significant events, and MRSI was at the forefront. With appearances at IMAPS New England in Boxborough, MA, and the 2024 Semiconductor Advanced Technology Innovation Development and Opportunities Conference in Suzhou, China, we showcased our advanced technology.

Precision and Reliability in Defense Electronics: Exploring MRSI’s Industry-Leading Solutions

Designing and manufacturing electronic components destined for defense applications entails navigating a landscape of exacting standards. These standards demand unparalleled reliability, minimal defect rates, and compact form factors to meet the rigorous demands of the field. MRSI rises to this challenge, offering specialized die bonding solutions finely tuned for aerospace and defense requirements.

Optimizing Die Bonding with Planarity Control: Ensuring Precision in Device Attachment Across Industries

Achieving precise and reliable die bonding is crucial in numerous industries, especially when demanding a high degree of parallelism between bonding surfaces. Planarity control emerges as a vital tool in ensuring such accuracy.

Exploring Automotive LiDAR Packaging Trends

In the November/December 2023 issue of Chip Scale Review, MRSI delves into the fascinating world of automotive light detection and ranging (LiDAR) technology. This article explores the parallels and distinctions between LiDAR and optical transceivers.

Explore the Future of Photonics Industry with MRSI at CSC 2024 Conference

Join MRSI at the upcoming Compound Semiconductor Advanced Technology and Application Conference (CSC) taking place on May 22-23, 2024, in Suzhou, China. Dr. Limin Zhou, the General Manager of MRSI Automation (Shenzhen) Co., Ltd., and Senior Director of Strategic Marketing at MRSI Systems (Mycronic Group), will be presenting a groundbreaking session titled “A New Engine for the Development of Photonics Industry – Generative AI.”

Advancing Microelectronics: MRSI Mycronic’s Presence at IMAPS New England

In the ever-evolving landscape of microelectronics, innovation is paramount. Positioned at the forefront of this technological revolution is MRSI and we are bringing tomorrow’s electronics to life through our assembly solutions. We will be presenting and exhibiting at the IMAPS (International Microelectronics Assembly and Packaging Society) New England Symposium on May 7th, in Boxborough, MA (Booth #406). MRSI is proud to be a Platinum Sponsor again this year.

The MRSI-H1 Family: Unleashing Precision and Agility

The MRSI-H1 family of 1-micron flip-chip die bonders stands out as an advanced ultra-precision solution.

March will be a busy month for device packaging exhibitions. Please join MRSI Mycronic at these upcoming events. We hope to see you there to discuss our latest new product innovations. Learn more about how MRSI is bringing tomorrow’s electronics to life.

MRSI-705HF 5 micron high force die bonder won the award for “Infostone 2023 Optical Communication Most Competitive Equipment”

On December 28, 2023, MRSI (Mycronic Group) received the “Infostone 2023 Optical Communication Most Competitive Equipment” award for the MRSI-705HF 5 micron high force die bonder at the First Suzhou Optoelectronic Technology Industry Forum. There were six awards presented: “The Most Competitive Product of Optical Communication,” “The Most Competitive Equipment of Optical Communication,” “Excellent Technology Award,” “Excellent Quality Award,” “Innovation Breakthrough Award” and “Excellent Equipment Award.”

MRSI New Solution: Tape Holder

Automotive LiDAR: Photonics assembly requirements and trends

MRSI-705HF High Force Die Bonder for power devices and advanced chip packaging