1.5 micron die bonders
MRSI Systems' family of fully automated, high-speed, high-precision and flexible eutectic and epoxy die bonding systems offers a complete suite of products across the volume spectrum.
Our solutions help our customers to enable high throughput production, just-in-time supply, and fast-pace innovations of critical photonic components for high growth market segments such as hyper-scale data centers, 5G wireless, LiDAR, VR/AR. Product configurations address specific application needs such as high-power laser diodes and multi-die TO products such as WDM & EML-TOs.
Two main product families address high speed:
MRSI-HVM family
The MRSI-HVM Family is the best-in-class die bonder, offering leading speed, zero-time tool change, and <1.5 micron accuracy. The superior performance is enabled by dual heads, dual stages, an integrated “on-the-fly” tool changer, ultrafast eutectic stages, and multiple levels of parallel processing optimizations. The system is designed for specific applications including Chip-on-Carrier (CoC), Chip-on-Submount (CoS), and Chip-on-Baseplate (CoB) assembly using eutectic and/or epoxy stamping die bonding.
MRSI-H family
The MRSI-H Family provides proven superior flexibility for true multi-die, multi-process, multi-product high-volume high-mix production with <1.5 micron accuracy. The system is optimized for specific applications such as the high- growth high-power semiconductor laser diode (HPLD) market and TO applications. Specifically, the MRSI-H-LD is optimized for bonding large dies for high-power laser diodes, that are used in advanced photonics such as industrial lasers, optical fiber amplifications, lighting, and sensors. The MRSI-H-TO includes a dual-head motion system that performs TO pick-and-place/handling and die bonding in parallel to maximize throughput.
Learn more about MRSI
MRSI Systems, part of Mycronic Group, is the leading manufacturer of fully automated, high-speed, high-precision and flexible eutectic and epoxy die bonding systems. We offer solutions for research and development, low-to-medium volume production, and high-volume manufacturing of photonic devices such as lasers, detectors, modulators, AOCs, WDM/EML TO-Cans, Optical transceivers, LiDAR, VR/AR, sensors, silicon photonics, co-packaging optics, 3-D hybrid packaging, and optical imaging products.