1.5 micron die bonding

For high volume
production

1.5 micron die bonding

For high volume
production

1.5 micron die bonding

For high volume
production

Fully automated, high-speed, high-precision, high flexibility

scaling applications, ultimate speed

MRSI Systems' family of fully automated, high-speed, high-precision and flexible eutectic and epoxy die bonding systems offers a complete suite of products across the volume spectrum.


Key benefits

Each product family offers unique value propositions but every product delivers on 4 Key Benefits.

Key benefits MRSI

High Volume Solutions

Our solutions help our customers to enable high throughput production, just-in-time supply, and fast-pace innovations of critical photonic components for high growth market segments such as hyper-scale data centers, 5G wireless, LiDAR, VR/AR. Product configurations address specific application needs such as high-power laser diodes and multi-die TO products such as WDM & EML-TOs.

Two main product families address high volume

  • The MRSI-HVM Family is the best-in-class die bonder, offering leading speed, zero-time tool change, and <1.5 micron accuracy. The superior performance is enabled by dual heads, dual stages, an integrated “on-the-fly” tool changer, ultrafast eutectic stages, and multiple levels of parallel processing optimizations. The system is designed for specific applications including Chip-on-Carrier (CoC), Chip-on-Submount (CoS), and Chip-on-Baseplate (CoB) assembly using eutectic and/or epoxy stamping die bonding.

  • The MRSI-H Family provides proven superior flexibility for true multi-die, multi-process, multi-product high-volume high-mix production with <1.5 micron accuracy. The system is optimized for specific applications such as the high- growth high-power semiconductor laser diode (HPLD) market and TO applications. Specifically, the MRSI-H-LD is optimized for bonding large dies for high-power laser diodes, that are used in advanced photonics such as industrial lasers, optical fiber amplifications, lighting, and sensors. The MRSI-H-TO includes a dual-head motion system that performs TO pick-and-place/handling and die bonding in parallel to maximize throughput.

 

For further details dowload the product brochure on MRSI's website:

 


Learn more about MRSI

MRSI Systems, part of Mycronic Group, is the leading manufacturer of fully automated, high-speed, high-precision and flexible eutectic and epoxy die bonding systems. We offer “one-stop-shop” die bonding solutions for electronic and photonics industry.

www.mrsisystems.com

Mycronic use cookies to enhance and customize your experience using our web site. By browsing further, you agree that we use cookies.

Read our Privacy and Cookie Policies to find out more.