International Symposium on 3D Power Electronics Integration & Manufacturing
Join us for the 2026 3D-PEIM Symposium Hosted by the Arizona State University (ASU)
Experience the future of 3D Power Packaging at 3D-PEIM 2026, the premier symposium uniting world-class researchers, industry leaders, and innovators in heterogeneous integration. Hosted at the Arizona State University Skysong Complex, this year’s event pairs breakthrough technology with the sunshine and energy of Phoenix, Arizona.