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IMAPS New England 2026

International Microelectronics Assembly and Packaging Society (IMAPS) New England 52nd Symposium & Expo.

May 12 - May 13
Woburn, MA, USA
Die bonding
United States of America
English
IMAPS New England

This event is known for gathering industry leaders, innovators, and enthusiasts in the field of microelectronics and packaging, providing a platform for networking, showcasing new technologies, and discussing the latest trends.

The event will be co-located with IMAPS Corporate Wire Bonding Workshop at the Crowne Plaza in Woburn, MA.