IMAPS Onshoring Advanced Packaging and Assembly
Onshoring Advanced Packaging and Assembly An IMAPS/Global electronics association Workshop Focused on Increasing Domestic Microelectronics Production August 31 - September 2, 2026 Hosted by IMAPS and Global Electronics Association, the Onshoring Advanced Packaging Workshop brings together the U.S. Government, DIB (Defense Industrial Base), and key stakeholders to drive microelectronics packaging and assembly onshoring.
Discover emerging government‑led advanced packaging initiatives and collaborate with suppliers, researchers, and integrators to strengthen the Advanced Packaging Supply‑Chain Onshoring ecosystem in America. The mission of this workshop is to engage our workforce community to raise awareness of emerging technology and promote new use cases for advanced packaging capabilities which address US Government and Defense requirements critical to the onshoring of the microelectronic assembly and packaging supply chain. Government agencies including the Department of Commerce/NIST, DoD (SHIP/IBAS/Title III), and DARPA will have program briefings presented from their programs that contain advanced packaging.