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2 MAY 2024, 20:03
NEWS
DIE BONDING SOLUTIONS

In the ever-evolving landscape of microelectronics, innovation is paramount. Positioned at the forefront of this technological revolution is MRSI and we are bringing tomorrow’s electronics to life through our assembly solutions. We will be presenting and exhibiting at the IMAPS (International Microelectronics Assembly and Packaging Society) New England Symposium on May 7th, in Boxborough, MA (Booth #406). MRSI is proud to be a Platinum Sponsor again this year.

IMAPS New England Symposium: A Hub of Innovative Connections

The IMAPS New England Symposium serves as a pivotal gathering point where industry leaders, researchers, and innovators converge to explore the latest advancements in microelectronics. Held annually, this symposium provides a platform for networking, knowledge sharing, and collaboration within the microelectronics community. With a focus on emerging technologies, materials, and processes, IMAPS New England Symposium plays a role in shaping the future of microelectronics.

MRSI Mycronic: A Leader in the Microelectronics Industry

MRSI has solidified its position as a leader in the field of microelectronics, renowned for its groundbreaking solutions and cutting-edge technologies. Specializing in die bonding and epoxy dispensing equipment, MRSI’s innovative approach has redefined possibilities in microelectronics manufacturing. By harnessing precision engineering, we empower customers to achieve unparalleled performance and efficiency in their production processes.

Exhibiting Innovative Solutions

At the IMAPS New England Symposium, MRSI will showcase our latest innovations. We will explain the technical expertise behind our solutions, highlighting our capabilities and potential applications in various industries. Peter Cronin, Director of Sales, North America, MRSI will co-chair the Photonics Packing session.

Join us at IMAPS New England

See the full program and register here.