Attend IMAPS New England and IMAPS Wire Bonding this May
MRSI Mycronic will exhibit at the International Microelectronics Assembly & Packaging Society (IMAPS) New England Chapter’s 52nd Symposium & Exhibition, held in conjunction with the IMAPS Wire Bonding Workshop on May 12–13, 2026, at the Crowne Plaza in Woburn, MA.
This premier event brings together industry leaders, engineers, and professionals to explore the latest advancements in microelectronics assembly and packaging. The program features technical sessions, hands-on workshops, and an exhibition showcasing innovative solutions from leading companies. Attendees will have opportunities to network with experts, gain insight into emerging technologies, and exchange ideas that advance the industry.
MRSI is proud to continue its longstanding sponsorship of this event in support of the IMAPS New England Chapter. The organization plays a vital role in providing educational opportunities, mentorship, and resources that help develop the next generation of engineers in microelectronics. Through this partnership, MRSI contributes to building a skilled workforce and strengthening the broader innovation ecosystem. We look forward to another successful symposium that fosters collaboration and drives progress across the industry.
We invite you to contact us to arrange a meeting during the IMAPS New England Symposium this May. This is an excellent opportunity to engage in meaningful discussions about the latest advancements in microelectronics, explore potential collaborations, and identify innovative solutions for the future. We look forward to connecting with you and working together to advance the industry.
Find event details and sign up at iMAPS New England.
