Driving the Future: Dr. Limin Zhou to Present on AI-Driven Optical Module Packaging at the Innovation Conference on CPO (Co-Packaged Optics) and Heterogeneous Integration Technology
The Innovation Conference on CPO and Heterogeneous Integration Technology will take place September 4-6, 2025, in Wuxi, China. During the conference, Dr. Limin Zhou will discuss recent and upcoming advancements in high-speed optical module packaging.
Spotlight Session: AI-Driven High-Speed Optical Module Packaging Tech Trends
MRSI, a recognized leader in optical module packaging solutions, is proud to have Dr. Zhou representing our latest advancements. In a world rapidly evolving due to generative AI, the demand for computing powerespecially from large language models (LLMsis skyrocketing. High-speed optical modules serve as the thoroughfare of modern computing infrastructure, and as the requirements for these optical module packages evolve, so must the packaging technology that supports them.
Why This Session Matters
- Rapid Technological Evolution: To boost transmission rates and reduce power consumption, high-speed optical module packaging is undergoing transformation at an unprecedented pace.
- From Traditional to Integrated: Recent years have seen a remarkable transition from conventional packages to highly integrated solutions, leading to significant industry breakthroughs.
- Market Opportunities: Dr. Zhou will break down the latest market dynamics, highlight recent innovations, and identify future opportunities.
MRSI’s Leadership in the Industry
Dr. Zhou’s presentation will also spotlight MRSI’s latest technologies—designed specifically to address the packaging challenges and opportunities of AI-driven high-speed optical modules. MRSI’s ongoing initiatives are not merely keeping pace with industry advancements; rather, we are actively setting new benchmarks for technological progress in the field.
